2024-03-28T08:54:30Z
https://nagoya.repo.nii.ac.jp/oai
oai:nagoya.repo.nii.ac.jp:00005171
2023-01-16T03:49:45Z
320:321:322
Partial discharge inception characteristics under butt gap condition in liquid nitrogen/ PPLP/sup /spl reg// composite insulation system for high temperature superconducting cable
Hazeyama, M.
Kobayashi, T.
Hayakawa, N.
Honjo, S.
Masuda, T.
Okubo, H.
open access
Copyright © 2002 IEEE. Reprinted from (relevant publication info). This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Nagoya University’s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org.
The partial discharge (PD) inception characteristics are studied in liquid nitrogen (LN,)/polypropylene laminated paper (PPLPm) composite insulation system for high temperature superconducting (HTS) cable. Experimental results revealed that the magnitude of the initial PD increased as the PD inception electric field strength was increased, because the injected energy increased. Initial PD was generated at the first and third quadrant of applied ac voltage phase. The probability of initial PD at the positive and negative voltage phase was almost the same. The reason is because liquid nitrogen is nonpolar molecule and we used symmetric electrode configuration with uniform electric field distribution. Finally, it was pointed out that PD inception electric field strength (PDIE) depended on the volume of the butt gap because of the increasing probability of weak points of electrical insulation, and PDIE linearly decreased with increasing stressed volume of the butt gap in the loglog scale.
IEEE
2002-12
eng
journal article
VoR
http://hdl.handle.net/2237/6755
https://nagoya.repo.nii.ac.jp/records/5171
https://doi.org/10.1109/TDEI.2002.1115487
1070-9878
IEEE Transactions on Dielectrics and Electrical Insulation
9
6
939
944
https://nagoya.repo.nii.ac.jp/record/5171/files/01115487.pdf
application/pdf
376.4 kB
2018-02-19