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2023-01-16T03:59:17Z
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Application of Functionally Graded Material for Reducing Electric Field on Electrode and Spacer Interface
Kurimoto, Muneaki
Kato, Katsumi
Hanai, Masahiro
Hoshina, Yoshikazu
Takei, Masafumi
Okubo, Hitoshi
open access
© 2010 IEEE. Reprinted, with permission, from Kurimoto, Muneaki; Kato, Katsumi; Hanai, Masahiro; Hoshina,Yoshikazu; Takei, Mmasafumi; Okubo, Hitoshi, Application of functionally graded material for reducing electricfield on electrode and spacer interface, Dielectrics and Electrical Insulation, IEEE Transactions on, Feb/2010
Functionally graded material (FGM)
Permittivity
Electric field
Spacer
Epoxy resin
Filler
Centrifugal force
Gas insulated switchgear (GIS)
For the size reduction and the enhancing reliability of electric power equipment, the electric field stress around solid insulators should be considered enough. For the relaxation of the field stress, the application of FGM (Functionally Graded Materials) with spatial distribution of dielectric permittivity (ε-FGM) can be an effective solution. In this paper, we investigated the applicability of ε-FGM for reducing the electric field stress on the electrode surface with contact to the solid dielectrics, which was one of the important factors dominating a long-term reliability of the insulating spacer. Firstly, we carried out numerical simulation of electric field to confirm the reduction of the electric stress by U-shape permittivity distribution. Secondly, we investigated the fabrication feasibility of ε-FGM with the U-shape distribution. Thirdly, we estimated the long-term electrical insulation performance of the ε-FGM. Finally, we verified the applicability and the fabrication technique of the ε-FGM to solid dielectrics for improvement of the electric stress and the long-term insulation performance in electric power equipment.
IEEE
2010-02
eng
journal article
AM
http://hdl.handle.net/2237/14528
https://nagoya.repo.nii.ac.jp/records/12641
https://doi.org/10.1109/TDEI.2010.5412025
1070-9878
Dielectrics and Electrical Insulation, IEEE Transactions on
17
1
256
263
https://nagoya.repo.nii.ac.jp/record/12641/files/1097.pdf
application/pdf
721.7 kB
2018-02-20