2024-03-29T12:10:18Z
https://nagoya.repo.nii.ac.jp/oai
oai:nagoya.repo.nii.ac.jp:00018629
2023-01-16T04:46:20Z
673:674:675
Conditioning Mechanism of Cu-Cr Electrode Based on Electrode Surface State under Impulse Voltage Application in Vacuum
Kojima, Hiroki
Hayakawa, Naoki
Nishimura, Ryouki
Okubo, Hitoshi
Sato, Hiromasa
Saito, Hitoshi
Noda, Yasushi
open access
© 2011 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
impulse conditioning
vacuum
Cu-Cr
deposited layer
parallel-plane electrode
quasi-uniform electric field
electrode surface
Because of high insulation performance and environmental-friendliness, vacuum is attracting considerable attention, and vacuum circuit breakers (VCBs) are expected to develop into higher voltage level. In this paper, we investigated the relationship between the surface condition and the conditioning mechanism of Cu-Cr electrode during impulse voltage application in vacuum. The experimental results showed that a layer of anode material was deposited on the cathode surface, owing to the impulse voltage applications. In addition, we investigated the content ratio of cathode and anode material on the surface after the saturation of electrode conditioning and relationship between the breakdown (BD) discharge area and deposited area during electrode conditioning process. We found that under impulse voltage application, the cathode surface characteristics approach the anode material characteristics, but that the content ratio of Cu to Cr differed between the electrodes. This means that anode material could determine the final state of the conditioning process.
IEEE
2011-12
eng
journal article
AM
http://hdl.handle.net/2237/20726
https://nagoya.repo.nii.ac.jp/records/18629
https://doi.org/10.1109/TDEI.2011.6118651
1070-9878
IEEE Transactions on Dielectrics and Electrical Insulation
18
6
2108
2114
https://nagoya.repo.nii.ac.jp/record/18629/files/1.pdf
application/pdf
834.4 kB
2018-02-21