2024-03-29T14:45:04Z
https://nagoya.repo.nii.ac.jp/oai
oai:nagoya.repo.nii.ac.jp:00026423
2023-01-16T04:34:05Z
673:674:675
Influence of Nanopore Diameter on Dielectric Permittivity of Epoxy/Open Nanoporous Silica Microcomposites
Kurimoto, Muneaki
Yamashita, Yuu
Yoshida, Takuma
Kato, Takeyoshi
Funabashi, Toshihisa
Suzuoki, Yasuo
open access
“© 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.”
Open-nanoporous silica filler
nanometric pore
epoxy composite
low permittivity
The purpose of this study was to obtain epoxy/open nanoporous silica (ONPS) microcomposites whose permittivity was lower than that of the unfilled epoxy resin. The ONPS filler comprised silica particles containing nanometric pores that were open at the particle surface. The particle size of the ONPS filler used in this study was on the order of micrometers. If air pores inside the ONPS filler remain unfilled with epoxy resin, the ONPS filler can be used as a low-permittivity filler for epoxy composites. In this study, we investigated the appropriate pore diameter of the ONPS filler for lowering the permittivity of epoxy/ONPS microcomposites. The permittivities of the epoxy/ONPS microcomposites were compared for ONPS fillers with the average pore diameters in the range from 0.6 nm to 15 nm. The permittivity of the epoxy/ONPS microcomposite whose average pore diameter was 3 nm was found to be lower than that of the unfilled epoxy resin. This low-permittivity characteristic can be explained quantitatively in terms of the pore volume. These results are expected to be useful for selecting ONPS fillers for epoxy/ONPS microcomposites that can be used as lowpermittivity insulating materials.
IEEE
2018-07-19
eng
journal article
AM
http://hdl.handle.net/2237/00028626
https://nagoya.repo.nii.ac.jp/records/26423
https://doi.org/10.1109/TDEI.2018.006846
1070-9878
IEEE Transactions on Dielectrics and Electrical Insulation
25
3
1022
1029
https://nagoya.repo.nii.ac.jp/record/26423/files/1_ForNUrepositry6846proofed_correct.pdf
application/pdf
754.2 kB
2018-10-16