2024-03-29T00:46:21Z
https://nagoya.repo.nii.ac.jp/oai
oai:nagoya.repo.nii.ac.jp:00007718
2023-01-16T03:53:09Z
320:321:322
Novel Wet Anisotropic Etching Process for the Realization of New Shapes of Silicon MEMS Structures
Pal, Prem
21873
Sato, Kazuo
21874
Gosalvez, Miguel A.
21875
Shikida, Mitsuhiro
21876
In this work, we have developed a novel anisotropic wet etching process for the fabrication of MEMS microstructures with rounded concave and sharp convex corners, grooves for chip isolation, mesa structures with bent V-grooves, and 45°mirrors by using a single etching mask. Tetra Methyl Ammonium Hydroxide (TMAH) at various concentrations with and without the non-ionic surfactant NC-200 at 0.1% of the total volume of the etchant has been used. In order to fabricate the microstructures with rounded concave corners, round shape mask pattern was used. Mesa structures and grooves for chip isolation were realized using spatially efficient convex corner compensation structures.
journal article
IEEE
2007
application/pdf
International Symposium on Micro-NanoMechatronics and Human Science
499
504
http://hdl.handle.net/2237/9437
https://nagoya.repo.nii.ac.jp/record/7718/files/sato_499.pdf
eng
https://doi.org/10.1109/MHS.2007.4420906
978-1-4244-1858-9
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