2024-03-28T16:25:49Z
https://nagoya.repo.nii.ac.jp/oai
oai:nagoya.repo.nii.ac.jp:00009364
2023-01-16T03:55:00Z
320:502:503
Miniaturization of on-wall in-tube flexible thermal flow sensor using heat shrinkable tube
Naito, J.
26787
Shikida, M.
26788
Hirota, M.
26789
Tan, Z.Y.
26790
Sato, K.
26791
佐藤, 一雄
26792
We previously proposed a novel type of on-wall in-tube thermal flow sensor, and experimentally evaluated its performance. The sensor has an advantage that it can measure the flow-rate both at near the tube entrance (hydraulically developing region) [1] and at bent tube (axially asymmetric flow) [2]. With the requirements of further miniaturization of the sensor in the fields of the portable fuel cells and chemical analyzers, we newly developed the fabrication process to miniaturize it less than 2.0 mm in external diameter by using a heat shrinkable tube. The film sensor fabricated by photolithography was inserted inside tube manually. By applying heat shrinking process, the film was automatically mounted on the inner wall surface, and the outer size of the tube was miniaturized to almost of the half size from its original. The final inner and outer diameters of the tube were 1.2 mm and 1.7 mm, respectively. We evaluated the fundamental performance of this flow sensor. The electrical resistance at the sensor linearly increased with temperature. The obtained temperature coefficient of resistance of the sensing element was 0.0023 K-1. We measured the relationship between the input power consumption and the gas flow rate, and finally evaluated the response time. We obtained a value of 100 msec by forming a cavity structure under the heat element.
journal article
IEEE
2008-01
application/pdf
IEEE 21st International Conference on Micro Electro Mechanical Systems (MEMS 2008)
924
927
http://hdl.handle.net/2237/11139
1084-6999
https://nagoya.repo.nii.ac.jp/record/9364/files/08_MEMS_Naito.pdf
eng
https://doi.org/10.1109/MEMSYS.2008.4443808
978-1-4244-1793-3
Copyright © 2008 IEEE. Reprinted from IEEE 21st International Conference on Micro Electro Mechanical Systems, 2008, MEMS, p.924-927. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Nagoya University’s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org.