2024-03-28T23:03:11Z
https://nagoya.repo.nii.ac.jp/oai
oai:nagoya.repo.nii.ac.jp:00010308
2023-01-16T03:56:20Z
320:502:503
Partial Discharge Detection Techniques under the Condition of Metallic Particle Adhering to Solid Spacer in SF_6
Okubo, Hitoshi
31246
Nishizawa, Kanako
31247
Okusu, Takashi
31248
Hayakawa, Naoki
31249
Endo, Fumihiro
31250
Yoshida, Masanobu
31251
Uchida, Katsumi
31252
Among the insulation defects in GIS under the operating condition, metallic particles adhered to the solid spacer would be the most critical situation against the surge voltage applications. Nevertheless, because of the complicated partial discharge (PD) mechanisms, PD detection can be recognized very difficult in GIS diagnostic techniques. In this paper, we have successfully simulated the condition of particle adhering on the spacer surface by an experiment applying an ac sudden step voltage. We firstly measured the time dependent PD characteristics, from immediately after the attachment of the particle, by using PD-CPWA (Partial Discharge Current Pulse Waveform Analysis) technique. The PD activities at the particle tip have different characteristics depending on the particle length and the diameter, as well as the gas pressure. Next, we have discussed that depending on the particle conditions, the PD characteristics can be changed with time and with ac half cycle of the polarity and have different sensitivity. Therefore, we need to identify the assessment criteria of GIS, based on the above mentioned phenomena and the facts. Finally, from analyses of PD mechanisms, we proposed the optimum PD detection techniques for adhering particles on solid spacer in GIS.
journal article
IEEE
2008-10
application/pdf
Annual Report Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2008)
395
399
http://dx.doi.org/10.1109/CEIDP.2008.4772822
http://hdl.handle.net/2237/12128
https://nagoya.repo.nii.ac.jp/record/10308/files/CEIDP2008-000107.pdf
eng
https://doi.org/10.1109/CEIDP.2008.4772822
Copyright © 2008 IEEE. Reprinted from Annual Report Conference on Electrical Insulation and Dielectric Phenomena, 2008. CEIDP 2008. p.395-399.<br/>This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Nagoya University’s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org.