2024-03-29T01:31:35Z
https://nagoya.repo.nii.ac.jp/oai
oai:nagoya.repo.nii.ac.jp:00024121
2023-01-16T04:14:10Z
320:606:607
Study on Manufacturing Process and Reliability of Cu Interconnects in Advanced LSI
LSIデバイス微細Cu配線のプロセスと高信頼性化に関する研究
虎澤, 直樹
71540
TORAZAWA, Naoki
71541
名古屋大学
Nagoya University
博士(工学)
doctoral thesis
2017-03-27
application/pdf
application/pdf
application/pdf
乙第7202号
http://hdl.handle.net/2237/26338
https://nagoya.repo.nii.ac.jp/record/24121/files/o7202_thesis.pdf
https://nagoya.repo.nii.ac.jp/record/24121/files/o7202_abstract.pdf
https://nagoya.repo.nii.ac.jp/record/24121/files/o7202_review.pdf
jpn