2024-03-29T00:47:09Z
https://nagoya.repo.nii.ac.jp/oai
oai:nagoya.repo.nii.ac.jp:00028687
2023-01-16T04:20:56Z
320:321:322
Enhancement of bending strength, thermal stability and recyclability of carbon-fiber-reinforced thermoplastics by using silica colloids
Yamamoto, Tetsuya
94157
Yabushita, Sho
94158
Irisawa, Toshihira
94159
Tanabe, Yasuhiro
94160
Carbon-fiber-reinforced thermoplastics
Silica colloid
Recycling
Interfacial properties
Thermal stability
Many light but strong composite materials are fabricated using carbon fibers, such as carbon-fiber-reinforced thermoplastics (CFRTPs). However, considering the life cycle of carbon fibers, a technique for recycling carbon fibers is required to sustainably manufacture such composites. To develop a technique for recycling highly valuable carbon fibers from CFRTPs by using nylon, heat-resistant silica colloids with sizes of 45.2 nm were synthesized via a sol–gel reaction. The silica colloids were adsorbed onto the carbon fibers via electrodeposition, which enhanced the interfacial properties of the CFRTP and in turn improved its mechanical properties. The fabricated CFRTP showed homogeneous strength because the silica particles acted as spacers between the carbon fibers, which adhered to each other owing to their hydrophobicity in the nylon resin. Additionally, the mechanical properties of CFRTP were maintained above room temperature. When carbon fibers were reclaimed from the CFRTP via heating up to 500 °C in air, the silica colloids deposited on the carbon fibers helped prevent the tensile strength of the fibers from degrading owing to the oxygen in air during the heating process. The present study demonstrated that the silica colloid surface modification enhanced the mechanical properties, thermal stability, and recyclability of CFRTPs.
ファイル公開:2021-09-08
journal article
Elsevier
2019-09-08
application/pdf
Composites Science and Technology
181
107665
0266-3538
https://nagoya.repo.nii.ac.jp/record/28687/files/Ymanu-RECF-final.pdf
eng
https://doi.org/10.1016/j.compscitech.2019.05.022
© 2019. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/