2024-03-28T19:24:19Z
https://nagoya.repo.nii.ac.jp/oai
oai:nagoya.repo.nii.ac.jp:00030761
2023-01-16T05:13:16Z
320:2524:2544:2554
On the stress measurement method using grain growth process of electrodeposited copper foil
Kitaoka, Seiichiro
102037
Ohshima, Kazuhiko
102038
1987-10-31
Using electrodeposited copper foil, the relation between the magnitude of cyclic stress and the number of cycles for the initiation of grain growth and the threshold stresses for grain nucleation and grain growth were examined. On the basis of the test results, the possibility of the stress measurement using grain growth process was investigated. The threshold stress of grain growth is remarkably lower than that of grain nucleation and the former is controlled by the amplitude of shearing stress as well as the latter. So, taking notice of the phenomenon of grain growth threshold, stress measurement can be done under lower strain amplitude compared with the electroplating method used until now.
departmental bulletin paper
Faculty of Engineering, Nagoya University
1987-10-31
Memoirs of the Faculty of Engineering, Nagoya University
1
39
155
162
0027-7657
eng