{"created":"2021-03-01T06:17:04.787099+00:00","id":10264,"links":{},"metadata":{"_buckets":{"deposit":"958dae6d-5519-4a95-8b03-9052f0838e95"},"_deposit":{"id":"10264","owners":[],"pid":{"revision_id":0,"type":"depid","value":"10264"},"status":"published"},"_oai":{"id":"oai:nagoya.repo.nii.ac.jp:00010264","sets":["312:598:599"]},"author_link":["31101","31102","31103","31104"],"item_10_biblio_info_6":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2008-07","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"97","bibliographicPageStart":"93","bibliographic_titles":[{"bibliographic_title":"International Conference on Embedded Software and Systems (ICESS '08)","bibliographic_titleLang":"en"}]}]},"item_10_description_4":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"A number of approaches have been proposed so far for reducing the energy consumption of embedded systems by using scratch-pad memory. However, most of previous work focused on dynamic energy reduction, and did not take enough consideration of the leakage energy in their evaluations. As the technology scales down to the deep submicron domain, the leakage energy in memory devices could contribute to a significant portion of the total energy consumption. Therefore, evaluation of energy consumption including the leakage energy is necessary. In this paper, we investigate the effectiveness of scratch-pad memory on energy reduction considering both the dynamic and leakage energy. The experiments are performed for 65 nm, 45 nm, and 32 nm technologies. The results demonstrate the  effectiveness of scratch-pad memory in deep submicron technology. It is also observed that the leakage energy becomes less significant along with the technology scaling.","subitem_description_language":"en","subitem_description_type":"Abstract"}]},"item_10_identifier_60":{"attribute_name":"URI","attribute_value_mlt":[{"subitem_identifier_type":"DOI","subitem_identifier_uri":"http://dx.doi.org/10.1109/ICESS.2008.60"},{"subitem_identifier_type":"HDL","subitem_identifier_uri":"http://hdl.handle.net/2237/12084"}]},"item_10_publisher_32":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"IEEE","subitem_publisher_language":"en"}]},"item_10_relation_11":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_type":"isVersionOf","subitem_relation_type_id":{"subitem_relation_type_id_text":"https://doi.org/10.1109/ICESS.2008.60","subitem_relation_type_select":"DOI"}}]},"item_10_rights_12":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"Copyright © 2008 IEEE. Reprinted from International Conference on Embedded Software and Systems, 2008. ICESS '08. p.93-97. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply <br/>IEEE endorsement of any of Nagoya University’s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for <br/>creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org.","subitem_rights_language":"en"}]},"item_10_select_15":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_select_item":"publisher"}]},"item_10_text_14":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_text_value":"application/pdf"}]},"item_1615787544753":{"attribute_name":"出版タイプ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_access_right":{"attribute_name":"アクセス権","attribute_value_mlt":[{"subitem_access_right":"open access","subitem_access_right_uri":"http://purl.org/coar/access_right/c_abf2"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Takase, Hideki","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"31101","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Tomiyama, Hiroyuki","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"31102","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Zeng, Gang","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"31103","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Takada, Hiroaki","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"31104","nameIdentifierScheme":"WEKO"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2018-02-20"}],"displaytype":"detail","filename":"icess2008.pdf","filesize":[{"value":"249.7 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"icess2008.pdf","objectType":"fulltext","url":"https://nagoya.repo.nii.ac.jp/record/10264/files/icess2008.pdf"},"version_id":"8fb4ce2a-bca3-4250-a6e9-2f307f8781b9"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Energy consumption","subitem_subject_scheme":"Other"},{"subitem_subject":"scratch-pad memory","subitem_subject_scheme":"Other"},{"subitem_subject":"embedded systems","subitem_subject_scheme":"Other"},{"subitem_subject":"deep submicron","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Energy Efficiency of Scratch-Pad Memory at 65 nm and Below: An Empirical Study","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Energy Efficiency of Scratch-Pad Memory at 65 nm and Below: An Empirical Study","subitem_title_language":"en"}]},"item_type_id":"10","owner":"1","path":["599"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2009-08-25"},"publish_date":"2009-08-25","publish_status":"0","recid":"10264","relation_version_is_last":true,"title":["Energy Efficiency of Scratch-Pad Memory at 65 nm and Below: An Empirical Study"],"weko_creator_id":"1","weko_shared_id":-1},"updated":"2023-01-16T03:56:07.230801+00:00"}