@article{oai:nagoya.repo.nii.ac.jp:00010276,
 author = {Pal, Prem and Sato, Kazuo},
 journal = {International Symposium on Micro-NanoMechatronics and Human Science (MHS 2008)},
 month = {Nov},
 note = {The present research report a fabrication process of suspended silicon microstructures of desired thickness over controlled depth micromachined cavities. The process is developed using  direct wafer bonding to seal the micromachined cavities and wet anisotropic etching in pure and  surfactant added tetramethyl ammonium hydroxide (TMAH) solutions. Wet anisotropic etching is  used for the formation of cavities, thinning down the wafer for structural layer and releasing  the structures. Non-ionic surfactant Triton-X-100 [C_14H_22O(C_2H_4O)_n] added TMAH is used to  realize the microstructures with rounded concave and sharp convex corners.},
 pages = {12--16},
 title = {Micromachined Sealed Cavities by Silicon Wafer Bonding for the Formation of Microstructures of Desired Thickness Using TMAH Etching},
 year = {2008}
}