{"created":"2021-03-01T06:17:05.538584+00:00","id":10276,"links":{},"metadata":{"_buckets":{"deposit":"faa4543d-47f4-4c52-9d73-13b47e023071"},"_deposit":{"id":"10276","owners":[],"pid":{"revision_id":0,"type":"depid","value":"10276"},"status":"published"},"_oai":{"id":"oai:nagoya.repo.nii.ac.jp:00010276","sets":["320:502:503"]},"author_link":["31153","31154"],"item_10_biblio_info_6":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2008-11","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"16","bibliographicPageStart":"12","bibliographic_titles":[{"bibliographic_title":"International Symposium on Micro-NanoMechatronics and Human Science (MHS 2008)","bibliographic_titleLang":"en"}]}]},"item_10_description_4":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"The present research report a fabrication process of suspended silicon microstructures of desired thickness over controlled depth micromachined cavities. The process is developed using  direct wafer bonding to seal the micromachined cavities and wet anisotropic etching in pure and  surfactant added tetramethyl ammonium hydroxide (TMAH) solutions. Wet anisotropic etching is  used for the formation of cavities, thinning down the wafer for structural layer and releasing  the structures. Non-ionic surfactant Triton-X-100 [C_14H_22O(C_2H_4O)_n] added TMAH is used to  realize the microstructures with rounded concave and sharp convex corners.","subitem_description_language":"en","subitem_description_type":"Abstract"}]},"item_10_identifier_60":{"attribute_name":"URI","attribute_value_mlt":[{"subitem_identifier_type":"DOI","subitem_identifier_uri":"http://dx.doi.org/10.1109/MHS.2008.4752414"},{"subitem_identifier_type":"HDL","subitem_identifier_uri":"http://hdl.handle.net/2237/12096"}]},"item_10_publisher_32":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"IEEE","subitem_publisher_language":"en"}]},"item_10_relation_11":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_type":"isVersionOf","subitem_relation_type_id":{"subitem_relation_type_id_text":"https://doi.org/10.1109/MHS.2008.4752414","subitem_relation_type_select":"DOI"}}]},"item_10_rights_12":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"Copyright © 2008 IEEE. Reprinted from International Symposium on Micro-NanoMechatronics and Human Science, 2008. MHS 2008. p.12-16.<br/>This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Nagoya University’s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org.","subitem_rights_language":"en"}]},"item_10_select_15":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_select_item":"publisher"}]},"item_10_text_14":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_text_value":"application/pdf"}]},"item_1615787544753":{"attribute_name":"出版タイプ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_access_right":{"attribute_name":"アクセス権","attribute_value_mlt":[{"subitem_access_right":"open access","subitem_access_right_uri":"http://purl.org/coar/access_right/c_abf2"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Pal, Prem","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"31153","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Sato, Kazuo","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"31154","nameIdentifierScheme":"WEKO"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2018-02-20"}],"displaytype":"detail","filename":"08_MHS_Prem.pdf","filesize":[{"value":"1.2 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"08_MHS_Prem.pdf","objectType":"fulltext","url":"https://nagoya.repo.nii.ac.jp/record/10276/files/08_MHS_Prem.pdf"},"version_id":"cce7413e-1f61-4e26-a66d-00d1cfb22071"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Micromachined Sealed Cavities by Silicon Wafer Bonding for the Formation of Microstructures of Desired Thickness Using TMAH Etching","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Micromachined Sealed Cavities by Silicon Wafer Bonding for the Formation of Microstructures of Desired Thickness Using TMAH Etching","subitem_title_language":"en"}]},"item_type_id":"10","owner":"1","path":["503"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2009-08-26"},"publish_date":"2009-08-26","publish_status":"0","recid":"10276","relation_version_is_last":true,"title":["Micromachined Sealed Cavities by Silicon Wafer Bonding for the Formation of Microstructures of Desired Thickness Using TMAH Etching"],"weko_creator_id":"1","weko_shared_id":-1},"updated":"2023-01-16T03:58:07.775653+00:00"}