{"created":"2021-03-01T06:17:38.356494+00:00","id":10788,"links":{},"metadata":{"_buckets":{"deposit":"d23f2908-c33b-40b9-a3d6-caab29d33307"},"_deposit":{"id":"10788","owners":[],"pid":{"revision_id":0,"type":"depid","value":"10788"},"status":"published"},"_oai":{"id":"oai:nagoya.repo.nii.ac.jp:00010788","sets":["673:674:675"]},"author_link":["32403","32404","32405","32406","32407","32408","32409","32410"],"item_10_biblio_info_6":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2009-05-13","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"19","bibliographicPageEnd":"191104","bibliographicPageStart":"191104","bibliographicVolumeNumber":"94","bibliographic_titles":[{"bibliographic_title":"APPLIED PHYSICS LETTERS","bibliographic_titleLang":"en"}]}]},"item_10_description_4":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"We have developed a laser terahertz emission microscope utilizing excitation laser pulses at 1.06 μm wavelength for the inspection and localization of electrical failures in large-scale integrated circuits with multilayered interconnection structures. The system enables to measure terahertz emission images from the backside of a large-scale integrated circuits chip with a multilayered interconnection structure that prevents the observation from the front side. By comparing the terahertz emission images, we successfully distinguish a normal circuit from damaged ones with different positions of the interconnection defects without any electrical probing.","subitem_description_language":"en","subitem_description_type":"Abstract"}]},"item_10_identifier_60":{"attribute_name":"URI","attribute_value_mlt":[{"subitem_identifier_type":"HDL","subitem_identifier_uri":"http://hdl.handle.net/2237/12631"},{"subitem_identifier_type":"DOI","subitem_identifier_uri":"http://dx.doi.org/10.1063/1.3133346"}]},"item_10_publisher_32":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"American Institite of Physics","subitem_publisher_language":"en"}]},"item_10_relation_11":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_type":"isVersionOf","subitem_relation_type_id":{"subitem_relation_type_id_text":"https://doi.org/10.1063/1.3133346","subitem_relation_type_select":"DOI"}}]},"item_10_rights_12":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"Copyright (2009) American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior per　mission of the author and the American Institute of Physics.","subitem_rights_language":"en"}]},"item_10_select_15":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_select_item":"publisher"}]},"item_10_source_id_7":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"0003-6951","subitem_source_identifier_type":"PISSN"}]},"item_10_text_14":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_text_value":"application/pdf"}]},"item_1615787544753":{"attribute_name":"出版タイプ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_access_right":{"attribute_name":"アクセス権","attribute_value_mlt":[{"subitem_access_right":"open access","subitem_access_right_uri":"http://purl.org/coar/access_right/c_abf2"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Yamashita, Masatsugu","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"32403","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Otani, Chiko","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"32404","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Kawase, Kodo","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"32405","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Matsumoto, Toru","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"32406","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Nikawa, Kiyoshi","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"32407","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Kim, Sunmi","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"32408","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Murakami, Hironaru","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"32409","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Tonouchi, Masayoshi","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"32410","nameIdentifierScheme":"WEKO"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2018-02-20"}],"displaytype":"detail","filename":"ApplPhysLett_94_191104.pdf","filesize":[{"value":"443.3 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"ApplPhysLett_94_191104.pdf","objectType":"fulltext","url":"https://nagoya.repo.nii.ac.jp/record/10788/files/ApplPhysLett_94_191104.pdf"},"version_id":"6c2cc79f-7ceb-46ad-b21d-3459e4c5f266"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"failure analysis","subitem_subject_scheme":"Other"},{"subitem_subject":"high-speed optical techniques","subitem_subject_scheme":"Other"},{"subitem_subject":"integrated circuit interconnections","subitem_subject_scheme":"Other"},{"subitem_subject":"integrated circuit testing","subitem_subject_scheme":"Other"},{"subitem_subject":"large scale integration","subitem_subject_scheme":"Other"},{"subitem_subject":"submillimetre wave imaging","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Backside observation of large-scale integrated circuits with multilayered interconnections using laser terahertz emission microscope","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Backside observation of large-scale integrated circuits with multilayered interconnections using laser terahertz emission microscope","subitem_title_language":"en"}]},"item_type_id":"10","owner":"1","path":["675"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2010-01-21"},"publish_date":"2010-01-21","publish_status":"0","recid":"10788","relation_version_is_last":true,"title":["Backside observation of large-scale integrated circuits with multilayered interconnections using laser terahertz emission microscope"],"weko_creator_id":"1","weko_shared_id":-1},"updated":"2023-01-16T04:48:44.196598+00:00"}