{"created":"2022-02-18T05:44:48.492732+00:00","id":2002103,"links":{},"metadata":{"_buckets":{"deposit":"1c94d01d-0081-46ac-97f6-b2393c2826fb"},"_deposit":{"created_by":17,"id":"2002103","owner":"17","owners":[17],"owners_ext":{"displayname":"図書情報係","username":"repository"},"pid":{"revision_id":0,"type":"depid","value":"2002103"},"status":"published"},"_oai":{"id":"oai:nagoya.repo.nii.ac.jp:02002103","sets":["673:674:675"]},"author_link":[],"control_number":"2002103","item_1615768549627":{"attribute_name":"出版タイプ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_ab4af688f83e57aa","subitem_version_type":"AM"}]},"item_1629683748249":{"attribute_name":"日付","attribute_value_mlt":[{"subitem_date_issued_datetime":"2022-08-10","subitem_date_issued_type":"Available"}]},"item_9_biblio_info_6":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2021-08-10","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"9","bibliographicPageStart":"648","bibliographicVolumeNumber":"127","bibliographic_titles":[{"bibliographic_title":"Applied Physics A","bibliographic_titleLang":"en"}]}]},"item_9_description_4":{"attribute_name":"内容記述","attribute_value_mlt":[{"subitem_description":"Gallium nitride (GaN)-based devices surpass the traditional silicon-based power devices in terms of higher breakdown voltage, faster-switching speed, higher thermal conductivity, and lower on-resistance. However, heteroepitaxial GaN growths like GaN on sapphire are not suitable for power devices due to the threading dislocation densities as high as 108/cm2. Recently, homoepitaxial GaN growth has become possible thanks to the native GaN substrates with dislocation densities in the order of 104/cm2 but the extremely high cost of the GaN substrates makes the homoepitaxy method unacceptable for industrial applications, and the slicing of wafers for reusing them is an effective solution for cost reduction. In this study, we will investigate a route for slicing the GaN single crystal substrate by controlling the laser pulse energy and changing the distance between each laser shot. The 2D and 3D crack propagations are observed by a multiphoton confocal microscope, and the cross section of samples is observed by a scanning electron microscope (SEM). The results showed that two types of radial and lateral cracking occurred depending on the pulse energy and shot pitch, and controlling them was of importance for attaining a smooth GaN substrate slicing. Cross-sectional SEM images showed that at suitable pulse energy and distance, crack propagation could be controlled with respect to the irradiation plane.","subitem_description_language":"en","subitem_description_type":"Abstract"}]},"item_9_publisher_32":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"Springer","subitem_publisher_language":"en"}]},"item_9_relation_43":{"attribute_name":"関連情報","attribute_value_mlt":[{"subitem_relation_type":"isVersionOf","subitem_relation_type_id":{"subitem_relation_type_id_text":"https://doi.org/10.1007/s00339-021-04808-y","subitem_relation_type_select":"DOI"}}]},"item_9_rights_12":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"This version of the article has been accepted for publication, after peer review (when applicable) and is subject to Springer Nature’s AM terms of use, but is not the Version of Record and does not reflect post-acceptance improvements, or any corrections. The Version of Record is available online at: http://dx.doi.org/10.1007/s00339-021-04808-y","subitem_rights_language":"en"}]},"item_9_source_id_7":{"attribute_name":"収録物識別子","attribute_value_mlt":[{"subitem_source_identifier":"0947-8396","subitem_source_identifier_type":"PISSN"}]},"item_access_right":{"attribute_name":"アクセス権","attribute_value_mlt":[{"subitem_access_right":"open access","subitem_access_right_uri":"http://purl.org/coar/access_right/c_abf2"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Sena, Hadi","creatorNameLang":"en"}]},{"creatorNames":[{"creatorName":"Tanaka, Atsushi","creatorNameLang":"en"}]},{"creatorNames":[{"creatorName":"Wani,Yotaro","creatorNameLang":"en"}]},{"creatorNames":[{"creatorName":"Aratani, Tomomi","creatorNameLang":"en"}]},{"creatorNames":[{"creatorName":"Yui, Toshiki","creatorNameLang":"en"}]},{"creatorNames":[{"creatorName":"Kawaguchi, Daisuke","creatorNameLang":"en"}]},{"creatorNames":[{"creatorName":"Sugiura, Ryuji","creatorNameLang":"en"}]},{"creatorNames":[{"creatorName":"Honda, Yoshio","creatorNameLang":"en"}]},{"creatorNames":[{"creatorName":"Igasaki, Yasunori","creatorNameLang":"en"}]},{"creatorNames":[{"creatorName":"Amano, Hiroshi","creatorNameLang":"en"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2022-08-10"}],"displaytype":"detail","filename":"Applied-physics-A-Sena.pdf","filesize":[{"value":"6.2 MB"}],"format":"application/pdf","mimetype":"application/pdf","url":{"objectType":"fulltext","url":"https://nagoya.repo.nii.ac.jp/record/2002103/files/Applied-physics-A-Sena.pdf"},"version_id":"1f63b7d9-f7cd-43c0-8e36-f8871f5fcd0d"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Gallium nitride (GaN)","subitem_subject_scheme":"Other"},{"subitem_subject":"Laser slicing","subitem_subject_scheme":"Other"},{"subitem_subject":"Sub-nanosecond laser","subitem_subject_scheme":"Other"},{"subitem_subject":"Liquid crystal on silicon (LCOS)","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Gallium nitride wafer slicing by a sub-nanosecond laser: effect of pulse energy and laser shot spacing","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Gallium nitride wafer slicing by a sub-nanosecond laser: effect of pulse energy and laser shot spacing","subitem_title_language":"en"}]},"item_type_id":"40001","owner":"17","path":["675"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2022-02-18"},"publish_date":"2022-02-18","publish_status":"0","recid":"2002103","relation_version_is_last":true,"title":["Gallium nitride wafer slicing by a sub-nanosecond laser: effect of pulse energy and laser shot spacing"],"weko_creator_id":"17","weko_shared_id":-1},"updated":"2023-01-16T05:13:41.744180+00:00"}