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  1. H200 未来材料・システム研究所
  2. H200a 雑誌掲載論文
  3. 学術雑誌

Modeling and Designing a GaN-Growth Reactor With Halogen-Free Vapor Phase Epitaxy: NH3 Decomposition at the Catalytic Surface of Components to Replicate Parasitic Polycrystal Formation

http://hdl.handle.net/2237/0002012960
http://hdl.handle.net/2237/0002012960
8f4a1f2e-0b87-4bbd-912b-fc41d382c507
名前 / ファイル ライセンス アクション
Accepted Accepted Paper_Maintext_H_Shimazu.pdf (5.5 MB)
アイテムタイプ itemtype_ver1(1)
公開日 2025-07-23
タイトル
タイトル Modeling and Designing a GaN-Growth Reactor With Halogen-Free Vapor Phase Epitaxy: NH3 Decomposition at the Catalytic Surface of Components to Replicate Parasitic Polycrystal Formation
言語 en
著者 Shimazu, Hiroki

× Shimazu, Hiroki

en Shimazu, Hiroki

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Nishizawa, Shin-Ichi

× Nishizawa, Shin-Ichi

en Nishizawa, Shin-Ichi

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Nitta, Shugo

× Nitta, Shugo

en Nitta, Shugo

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Amano, Hiroshi

× Amano, Hiroshi

en Amano, Hiroshi

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Nakamura, Daisuke

× Nakamura, Daisuke

en Nakamura, Daisuke

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アクセス権
アクセス権 open access
アクセス権URI http://purl.org/coar/access_right/c_abf2
権利
権利情報 “© 2025 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.”
言語 en
内容記述
内容記述タイプ Abstract
内容記述 Achieving long-duration, large bulk GaN growth is crucial to supply low-cost, high-quality GaN. Halogen-free vapor phase epitaxy (HF-VPE) is a promising method for bulk GaN growth but faces challenges due to severe polycrystals deposition on reactor components, such as the source-gas nozzles, which impedes stable, extended growth. In this study, we developed models to simulate the polycrystal deposition in HF-VPE-GaN growth conditions by including surface reactions of GaN formation and NH3 decomposition. Moreover, we devised conditions for controlling gas flow and interdiffusion to suppress polycrystal deposition around the source-gas nozzles. Experimental results aligned with simulations, showing that increasing the distance between Ga and NH3 nozzles and replacing the sheath gas from H2 to N2 effectively minimized polycrystal formation. The findings confirm that reducing NH3 concentration through catalytic surface decomposition on refractory components is crucial to polycrystal suppression. Optimizing nozzle dimensions and gas species synergistically controls the gas flow and interdiffusion. The constructed models contribute to advancing the design of polycrystal suppressive structures and conditions for long-duration bulk GaN growth.
言語 en
出版者
出版者 IEEE
言語 en
言語
言語 eng
資源タイプ
資源タイプresource http://purl.org/coar/resource_type/c_6501
タイプ journal article
出版タイプ
出版タイプ AM
出版タイプResource http://purl.org/coar/version/c_ab4af688f83e57aa
関連情報
関連タイプ isVersionOf
識別子タイプ DOI
関連識別子 https://doi.org/10.1109/TSM.2025.3558328
収録物識別子
収録物識別子タイプ PISSN
収録物識別子 0894-6507
書誌情報 en : IEEE Transactions on Semiconductor Manufacturing

巻 38, 号 2, p. 311-323, 発行日 2025-05
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