@article{oai:nagoya.repo.nii.ac.jp:00026423,
 author = {Kurimoto, Muneaki and Yamashita, Yuu and Yoshida, Takuma and Kato, Takeyoshi and Funabashi, Toshihisa and Suzuoki, Yasuo},
 issue = {3},
 journal = {IEEE Transactions on Dielectrics and Electrical Insulation},
 month = {Jul},
 note = {The purpose of this study was to obtain epoxy/open nanoporous silica (ONPS) microcomposites whose permittivity was lower than that of the unfilled epoxy resin. The ONPS filler comprised silica particles containing nanometric pores that were open at the particle surface. The particle size of the ONPS filler used in this study was on the order of micrometers. If air pores inside the ONPS filler remain unfilled with epoxy resin, the ONPS filler can be used as a low-permittivity filler for epoxy composites. In this study, we investigated the appropriate pore diameter of the ONPS filler for lowering the permittivity of epoxy/ONPS microcomposites. The permittivities of the epoxy/ONPS microcomposites were compared for ONPS fillers with the average pore diameters in the range from 0.6 nm to 15 nm. The permittivity of the epoxy/ONPS microcomposite whose average pore diameter was 3 nm was found to be lower than that of the unfilled epoxy resin. This low-permittivity characteristic can be explained quantitatively in terms of the pore volume. These results are expected to be useful for selecting ONPS fillers for epoxy/ONPS microcomposites that can be used as lowpermittivity insulating materials.},
 pages = {1022--1029},
 title = {Influence of Nanopore Diameter on Dielectric Permittivity of Epoxy/Open Nanoporous Silica Microcomposites},
 volume = {25},
 year = {2018}
}