{"created":"2021-03-01T06:38:47.028466+00:00","id":30462,"links":{},"metadata":{"_buckets":{"deposit":"f64a2202-3eb9-4ada-bde3-546adf8f28c2"},"_deposit":{"id":"30462","owners":[],"pid":{"revision_id":0,"type":"depid","value":"30462"},"status":"published"},"_oai":{"id":"oai:nagoya.repo.nii.ac.jp:00030462","sets":["320:321:322"]},"author_link":["101323","101324","101325","101326","101327","101328"],"item_10_biblio_info_6":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2020-03","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"88","bibliographicPageStart":"83","bibliographicVolumeNumber":"62","bibliographic_titles":[{"bibliographic_title":"Precision Engineering","bibliographic_titleLang":"en"}]}]},"item_10_description_4":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"This paper presents a novel method of improving material removal efficiency in the chemical mechanical polishing (CMP) process by optimizing the surface asperity orientation with respect to polishing motion. Feret's diameter plays a key role in increasing the number of working abrasives. Based on Feret's diameter model, an optimization method is proposed for the conditioning motion of a diamond dresser against a CMP pad. The radial velocity component of the dresser on the CMP pad is maximized by considering its direction of motion based on kinematic motion simulation. In addition, the pad cut rate profile is optimized to be uniform. Analytical and experimental investigations show that the ratio of radial and tangential velocity components is improved, yielding a larger Feret's diameter and 15% increase in the material removal rate.","subitem_description_language":"en","subitem_description_type":"Abstract"}]},"item_10_description_5":{"attribute_name":"内容記述","attribute_value_mlt":[{"subitem_description":"ファイル公開日: 2022/03/01","subitem_description_language":"ja","subitem_description_type":"Other"}]},"item_10_publisher_32":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"Elsevier","subitem_publisher_language":"en"}]},"item_10_relation_11":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_type":"isVersionOf","subitem_relation_type_id":{"subitem_relation_type_id_text":"https://doi.org/10.1016/j.precisioneng.2019.11.008","subitem_relation_type_select":"DOI"}}]},"item_10_rights_12":{"attribute_name":"権利","attribute_value_mlt":[{"subitem_rights":"© 2020. This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/","subitem_rights_language":"en"}]},"item_10_select_15":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_select_item":"author"}]},"item_10_source_id_61":{"attribute_name":"ISSN（print）","attribute_value_mlt":[{"subitem_source_identifier":"0141-6359","subitem_source_identifier_type":"PISSN"}]},"item_1615787544753":{"attribute_name":"出版タイプ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_ab4af688f83e57aa","subitem_version_type":"AM"}]},"item_access_right":{"attribute_name":"アクセス権","attribute_value_mlt":[{"subitem_access_right":"open access","subitem_access_right_uri":"http://purl.org/coar/access_right/c_abf2"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Suzuki, Norikazu","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"101323","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Misono, Hirotaka","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"101324","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Shamoto, Eiji","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"101325","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Hashimoto, Yohei","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"101326","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Yasuda, Hozumi","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"101327","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Mochizuki, Yoshihiro","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"101328","nameIdentifierScheme":"WEKO"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2022-03-01"}],"displaytype":"detail","filename":"PRE_2019_715_Original_V0.pdf","filesize":[{"value":"2.2 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"PRE_2019_715_Original_V0","objectType":"fulltext","url":"https://nagoya.repo.nii.ac.jp/record/30462/files/PRE_2019_715_Original_V0.pdf"},"version_id":"f121e6e1-5e2e-49a2-ab2f-5774204f1f31"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"Polishing","subitem_subject_scheme":"Other"},{"subitem_subject":"Dress","subitem_subject_scheme":"Other"},{"subitem_subject":"Conditioning","subitem_subject_scheme":"Other"},{"subitem_subject":"Surface asperity","subitem_subject_scheme":"Other"},{"subitem_subject":"Feret's diameter","subitem_subject_scheme":"Other"},{"subitem_subject":"Polishing pad","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"journal article","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"Material removal efficiency improvement by orientation control of CMP pad surface asperities","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Material removal efficiency improvement by orientation control of CMP pad surface asperities","subitem_title_language":"en"}]},"item_type_id":"10","owner":"1","path":["322"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2020-09-17"},"publish_date":"2020-09-17","publish_status":"0","recid":"30462","relation_version_is_last":true,"title":["Material removal efficiency improvement by orientation control of CMP pad surface asperities"],"weko_creator_id":"1","weko_shared_id":-1},"updated":"2023-01-16T04:23:56.685463+00:00"}