@article{oai:nagoya.repo.nii.ac.jp:00031686,
 author = {Ōkubo, Hajimu},
 journal = {Memoirs of the Faculty of Engineering, Nagoya University},
 month = {Feb},
 note = {This is the English translation of the author’s study on the electroplating method which was successively published in the Japanese journal “Kikai no Kenkyu” during the last several years. The outline of the present paper except the last portion was reported at the First All-Union Congress on Theoretical and Applied Mechanics of USSR, Moscow, January 27-February 3, 1960.Though the matter herein stated, partly, translated in English, was published in several foreign periodicals, the method proposed may be strange to most scientists in other countries who are acting in the field of experimental stress-analysis.The electroplating method is based on the sensitive colour change on the surface of plated copper made by micro-flecks and also on the grain growth in plated copper, both caused by the reversals of cyclic stress. The method has been applied to examine the stress concentration in shafts containing grooves or holes and has been proved useful for an accurate determination of peak stress. The method is also favourably applied to the determination of microscopic strain-distribution even in metals having rather small crystal grains. One promising field of application which will be developed in future is the prediction of fatigue failure which may occur in a machine element under operation. Quantitative determination of peak stress will be possible by this method for the machine element rotating in a closed casing, if more extensive investigation on the nature of flecking be completed in future.},
 pages = {1--44},
 title = {Electroplating method and its applications},
 volume = {11},
 year = {1960}
}