{"_buckets": {"deposit": "5577e314-630a-43fc-9d1c-d02b163a3d43"}, "_deposit": {"id": "9366", "owners": [], "pid": {"revision_id": 0, "type": "depid", "value": "9366"}, "status": "published"}, "_oai": {"id": "oai:nagoya.repo.nii.ac.jp:00009366", "sets": ["503"]}, "author_link": ["26795", "26796", "26797", "26798", "26799", "26800"], "item_10_biblio_info_6": {"attribute_name": "書誌情報", "attribute_value_mlt": [{"bibliographicIssueDates": {"bibliographicIssueDate": "2008-01", "bibliographicIssueDateType": "Issued"}, "bibliographicPageEnd": "450", "bibliographicPageStart": "447", "bibliographic_titles": [{"bibliographic_title": "IEEE 21st International Conference on Micro Electro Mechanical Systems (MEMS 2008)", "bibliographic_titleLang": "en"}]}]}, "item_10_description_4": {"attribute_name": "抄録", "attribute_value_mlt": [{"subitem_description": "This paper reports the mechanical properties of silicon carbide (SiC) films at elevated temperatures up to 500ºC. Poly-crystalline SiC film (poly-SiC) was deposited by LPCVD on a silicon wafer and patterned into a freestanding specimen on an “on-chip” tensile test device. The fracture strength of poly-SiC films showed little temperature dependence over the test temperature range. The tensile strength was 2.89 GPa at room temperature (RT), and decreased slightly to 2.66 GPa at 500ºC. The fracture surface at 500ºC showed almost the same morphology as that at RT, without any slippage. The potential of SiC films as a material for micromechanical devices working at high temperatures has been heretofore confirmed.", "subitem_description_language": "en", "subitem_description_type": "Abstract"}]}, "item_10_identifier_60": {"attribute_name": "URI", "attribute_value_mlt": [{"subitem_identifier_type": "HDL", "subitem_identifier_uri": "http://hdl.handle.net/2237/11140"}]}, "item_10_publisher_32": {"attribute_name": "出版者", "attribute_value_mlt": [{"subitem_publisher": "IEEE", "subitem_publisher_language": "en"}]}, "item_10_relation_11": {"attribute_name": "DOI", "attribute_value_mlt": [{"subitem_relation_type": "isVersionOf", "subitem_relation_type_id": {"subitem_relation_type_id_text": "https://doi.org/10.1109/MEMSYS.2008.4443689", "subitem_relation_type_select": "DOI"}}]}, "item_10_relation_8": {"attribute_name": "ISBN", "attribute_value_mlt": [{"subitem_relation_type": "isPartOf", "subitem_relation_type_id": {"subitem_relation_type_id_text": "978-1-4244-1793-3", "subitem_relation_type_select": "ISBN"}}]}, "item_10_rights_12": {"attribute_name": "権利", "attribute_value_mlt": [{"subitem_rights": "Copyright © 2008 IEEE. Reprinted from IEEE 21st International Conference on Micro Electro Mechanical Systems, 2008, MEMS, p.447-450. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Nagoya University’s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org.", "subitem_rights_language": "en"}]}, "item_10_select_15": {"attribute_name": "著者版フラグ", "attribute_value_mlt": [{"subitem_select_item": "publisher"}]}, "item_10_source_id_7": {"attribute_name": "ISSN", "attribute_value_mlt": [{"subitem_source_identifier": "1084-6999", "subitem_source_identifier_type": "PISSN"}]}, "item_10_text_14": {"attribute_name": "フォーマット", "attribute_value_mlt": [{"subitem_text_value": "application/pdf"}]}, "item_1615787544753": {"attribute_name": "出版タイプ", "attribute_value_mlt": [{"subitem_version_resource": "http://purl.org/coar/version/c_970fb48d4fbd8a85", "subitem_version_type": "VoR"}]}, "item_access_right": {"attribute_name": "アクセス権", "attribute_value_mlt": [{"subitem_access_right": "open access", "subitem_access_right_uri": "http://purl.org/coar/access_right/c_abf2"}]}, "item_creator": {"attribute_name": "著者", "attribute_type": "creator", "attribute_value_mlt": [{"creatorNames": [{"creatorName": "Nakao, S.", "creatorNameLang": "en"}], "nameIdentifiers": [{"nameIdentifier": "26795", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Ando, T.", "creatorNameLang": "en"}], "nameIdentifiers": [{"nameIdentifier": "26796", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Chen, L.", "creatorNameLang": "en"}], "nameIdentifiers": [{"nameIdentifier": "26797", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Mehregany, M.", "creatorNameLang": "en"}], "nameIdentifiers": [{"nameIdentifier": "26798", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Sato, K.", "creatorNameLang": "en"}], "nameIdentifiers": [{"nameIdentifier": "26799", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "佐藤, 一雄", "creatorNameLang": "ja"}], "nameIdentifiers": [{"nameIdentifier": "26800", "nameIdentifierScheme": "WEKO"}]}]}, "item_files": {"attribute_name": "ファイル情報", "attribute_type": "file", "attribute_value_mlt": [{"accessrole": "open_date", "date": [{"dateType": "Available", "dateValue": "2018-02-20"}], "displaytype": "detail", "download_preview_message": "", "file_order": 0, "filename": "08_MEMS_Nakao.pdf", "filesize": [{"value": "393.1 kB"}], "format": "application/pdf", "future_date_message": "", "is_thumbnail": false, "licensetype": "license_note", "mimetype": "application/pdf", "size": 393100.0, "url": {"label": "08_MEMS_Nakao.pdf", "objectType": "fulltext", "url": "https://nagoya.repo.nii.ac.jp/record/9366/files/08_MEMS_Nakao.pdf"}, "version_id": "10dbe0cf-c4e2-4fc6-b04c-6620de3ba0b2"}]}, "item_language": {"attribute_name": "言語", "attribute_value_mlt": [{"subitem_language": "eng"}]}, "item_resource_type": {"attribute_name": "資源タイプ", "attribute_value_mlt": [{"resourcetype": "journal article", "resourceuri": "http://purl.org/coar/resource_type/c_6501"}]}, "item_title": "Mechanical characterization of SiC film at high temperatures by tensile test", "item_titles": {"attribute_name": "タイトル", "attribute_value_mlt": [{"subitem_title": "Mechanical characterization of SiC film at high temperatures by tensile test", "subitem_title_language": "en"}]}, "item_type_id": "10", "owner": "1", "path": ["503"], "permalink_uri": "http://hdl.handle.net/2237/11140", "pubdate": {"attribute_name": "PubDate", "attribute_value": "2009-02-23"}, "publish_date": "2009-02-23", "publish_status": "0", "recid": "9366", "relation": {}, "relation_version_is_last": true, "title": ["Mechanical characterization of SiC film at high temperatures by tensile test"], "weko_shared_id": -1}