{"_buckets": {"deposit": "270b552b-9d34-430b-8dc1-703435541270"}, "_deposit": {"id": "12040", "owners": [], "pid": {"revision_id": 0, "type": "depid", "value": "12040"}, "status": "published"}, "_oai": {"id": "oai:nagoya.repo.nii.ac.jp:00012040"}, "item_10_biblio_info_6": {"attribute_name": "\u66f8\u8a8c\u60c5\u5831", "attribute_value_mlt": [{"bibliographicIssueDates": {"bibliographicIssueDate": "2009-01-25", "bibliographicIssueDateType": "Issued"}, "bibliographicPageEnd": "668", "bibliographicPageStart": "665", "bibliographic_titles": [{"bibliographic_title": "IEEE 22nd International Conference on Micro Electro Mechanical Systems (MEMS 2009)"}]}]}, "item_10_description_4": {"attribute_name": "\u6284\u9332", "attribute_value_mlt": [{"subitem_description": "Fatigue tests of silicon stepped cantilevers fabricated from silicon on insulator (SOI) wafers were conducted under the bending mode to evaluate the effect of cyclic loading on fractures occurring in silicon and Si/SiO2 interfaces. The specimen in the quasi-static mode fractured at the stress concentration site on the silicon specimens. However, during the fatigue tests the cantilever broke after 104 cycles with stress amplitude of nearly half of the bending strength at the fixed end comprising the Si/SiO2 interface. The results demonstrated that the cyclic stress durability in the Si/SiO2 interface is significantly lower than that of the silicon body.", "subitem_description_type": "Abstract"}]}, "item_10_identifier_60": {"attribute_name": "URI", "attribute_value_mlt": [{"subitem_identifier_type": "HDL", "subitem_identifier_uri": "http://hdl.handle.net/2237/13916"}, {"subitem_identifier_type": "DOI", "subitem_identifier_uri": "http://dx.doi.org/10.1109/MEMSYS.2009.4805470"}]}, "item_10_publisher_32": {"attribute_name": "\u51fa\u7248\u8005", "attribute_value_mlt": [{"subitem_publisher": "IEEE"}]}, "item_10_rights_12": {"attribute_name": "\u6a29\u5229", "attribute_value_mlt": [{"subitem_rights": "\u00a92009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE."}]}, "item_10_select_15": {"attribute_name": "\u8457\u8005\u7248\u30d5\u30e9\u30b0", "attribute_value_mlt": [{"subitem_select_item": "publisher"}]}, "item_10_source_id_7": {"attribute_name": "ISSN", "attribute_value_mlt": [{"subitem_source_identifier": "1084-6999", "subitem_source_identifier_type": "ISSN"}]}, "item_10_text_14": {"attribute_name": "\u30d5\u30a9\u30fc\u30de\u30c3\u30c8", "attribute_value_mlt": [{"subitem_text_value": "application/pdf"}]}, "item_creator": {"attribute_name": "\u8457\u8005", "attribute_type": "creator", "attribute_value_mlt": [{"creatorNames": [{"creatorName": "Ando, T"}], "nameIdentifiers": [{"nameIdentifier": "38181", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Takumi, T"}], "nameIdentifiers": [{"nameIdentifier": "38182", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Sato, K"}], "nameIdentifiers": [{"nameIdentifier": "38183", "nameIdentifierScheme": "WEKO"}]}]}, "item_files": {"attribute_name": "\u30d5\u30a1\u30a4\u30eb\u60c5\u5831", "attribute_type": "file", "attribute_value_mlt": [{"accessrole": "open_date", "date": [{"dateType": "Available", "dateValue": "2018-02-20"}], "displaytype": "detail", "download_preview_message": "", "file_order": 0, "filename": "09_MEMS_Ando.pdf", "filesize": [{"value": "816.3 kB"}], "format": "application/pdf", "future_date_message": "", "is_thumbnail": false, "licensetype": "license_free", "mimetype": "application/pdf", "size": 816300.0, "url": {"label": "09_MEMS_Ando.pdf", "url": "https://nagoya.repo.nii.ac.jp/record/12040/files/09_MEMS_Ando.pdf"}, "version_id": "a1792369-1387-4c27-b59e-fb566d8a943a"}]}, "item_language": {"attribute_name": "\u8a00\u8a9e", "attribute_value_mlt": [{"subitem_language": "eng"}]}, "item_resource_type": {"attribute_name": "\u8cc7\u6e90\u30bf\u30a4\u30d7", "attribute_value_mlt": [{"resourcetype": "journal article", "resourceuri": "http://purl.org/coar/resource_type/c_6501"}]}, "item_title": "Degradation of Mechanical Strength at Si/SiO2 Interface on SOI Wafers under Cyclic Loading", "item_titles": {"attribute_name": "\u30bf\u30a4\u30c8\u30eb", "attribute_value_mlt": [{"subitem_title": "Degradation of Mechanical Strength at Si/SiO2 Interface on SOI Wafers under Cyclic Loading"}]}, "item_type_id": "10", "owner": "1", "path": ["320/321/322"], "permalink_uri": "http://hdl.handle.net/2237/13916", "pubdate": {"attribute_name": "\u516c\u958b\u65e5", "attribute_name_i18n": "\u516c\u958b\u65e5", "attribute_value": "2010-08-03"}, "publish_date": "2010-08-03", "publish_status": "0", "recid": "12040", "relation": {}, "relation_version_is_last": true, "title": ["Degradation of Mechanical Strength at Si/SiO2 Interface on SOI Wafers under Cyclic Loading"], "weko_shared_id": null}