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  1. I500 未来社会創造機構
  2. I500a 雑誌掲載論文
  3. 学術雑誌

Electroplating of copper/microdiamond composites and the effect of diamond surface functionalization

http://hdl.handle.net/2237/0002001949
http://hdl.handle.net/2237/0002001949
303930e5-a7ac-47b2-a1b7-fd45b5f376d7
名前 / ファイル ライセンス アクション
Manuscript_FML_revised.pdf Manuscript_FML_revised.pdf (657 KB)
Item type itemtype_ver1(1)
公開日 2022-01-17
タイトル
タイトル Electroplating of copper/microdiamond composites and the effect of diamond surface functionalization
言語 en
著者 Naruse, Yuto

× Naruse, Yuto

en Naruse, Yuto

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Park, Jae-Hyeok

× Park, Jae-Hyeok

en Park, Jae-Hyeok

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Hagio, Tkeshi

× Hagio, Tkeshi

en Hagio, Tkeshi

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Kamimoto, Yuki

× Kamimoto, Yuki

en Kamimoto, Yuki

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Ichino, Ryoichi

× Ichino, Ryoichi

en Ichino, Ryoichi

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Bessho, Takeshi

× Bessho, Takeshi

en Bessho, Takeshi

Search repository
アクセス権
アクセス権 open access
アクセス権URI http://purl.org/coar/access_right/c_abf2
権利
言語 en
権利情報 Electronic version of an article published as [Functional Materials Letters. v.14, n.05, 2021, p.2151023] [http://doi.org/10.1142/S1793604721510231] © [copyright World Scientific Publishing Company] [https://www.worldscientific.com/worldscinet/fml]
キーワード
主題Scheme Other
主題 Copper
キーワード
主題Scheme Other
主題 diamond surface modification
キーワード
主題Scheme Other
主題 composite platings
キーワード
主題Scheme Other
主題 interfacial adhesion
キーワード
主題Scheme Other
主題 surface functionalization
内容記述
内容記述 Compositing diamonds with high thermally conductive metals, such as copper, have attracted much attention in recent years. In this study, we prepared copper/diamond composites by electroplating and investigated the effect of the surface functionalization of diamond on the interfacial adhesion of copper and diamond in the composite. Oxygen-containing groups were introduced on the diamond surface by a hydrothermal treatment and amino groups were further introduced using a silane coupling agent. Surface functionalization of diamond with both these groups led to drastically increased wettability against the copper sulfate solution and improved the interfacial adhesion of copper and diamond in the composite. Compared with that of the plating based on pristine diamond, the thermal conductivity of the platings based on diamond functionalized with oxygen-containing groups and amino groups increased by 42 and 31 W m^−1 K^−1, respectively. Thus, diamond surface functionalization effectively improved the adhesion at the copper/diamond interface in electroplated copper/diamond composites.
言語 en
内容記述タイプ Abstract
出版者
言語 en
出版者 World Scientific
言語
言語 eng
資源タイプ
資源タイプresource http://purl.org/coar/resource_type/c_6501
タイプ journal article
出版タイプ
出版タイプ AM
出版タイプResource http://purl.org/coar/version/c_ab4af688f83e57aa
関連情報
関連タイプ isVersionOf
識別子タイプ DOI
関連識別子 https://doi.org/10.1142/S1793604721510231
収録物識別子
収録物識別子タイプ PISSN
収録物識別子 1793-6047
書誌情報 en : Functional Materials Letters

巻 14, 号 05, p. 2151023, 発行日 2021-05-25
ファイル公開日
日付 2022-05-25
日付タイプ Available
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