{"_buckets": {"deposit": "3369bda9-29f9-44f8-9a6c-d873ce8bf256"}, "_deposit": {"created_by": 17, "id": "2001949", "owner": "17", "owners": [17], "owners_ext": {"displayname": "図書情報係", "username": "repository"}, "pid": {"revision_id": 0, "type": "depid", "value": "2001949"}, "status": "published"}, "_oai": {"id": "oai:nagoya.repo.nii.ac.jp:02001949", "sets": ["1941"]}, "author_link": [], "control_number": "2001949", "item_1615768549627": {"attribute_name": "出版タイプ", "attribute_value_mlt": [{"subitem_version_resource": "http://purl.org/coar/version/c_ab4af688f83e57aa", "subitem_version_type": "AM"}]}, "item_1629683748249": {"attribute_name": "日付", "attribute_value_mlt": [{"subitem_date_issued_datetime": "2022-05-25", "subitem_date_issued_type": "Available"}]}, "item_9_biblio_info_6": {"attribute_name": "書誌情報", "attribute_value_mlt": [{"bibliographicIssueDates": {"bibliographicIssueDate": "2021-05-25", "bibliographicIssueDateType": "Issued"}, "bibliographicIssueNumber": "05", "bibliographicPageStart": "2151023", "bibliographicVolumeNumber": "14", "bibliographic_titles": [{"bibliographic_title": "Functional Materials Letters", "bibliographic_titleLang": "en"}]}]}, "item_9_description_4": {"attribute_name": "内容記述", "attribute_value_mlt": [{"subitem_description": "Compositing diamonds with high thermally conductive metals, such as copper, have attracted much attention in recent years. In this study, we prepared copper/diamond composites by electroplating and investigated the effect of the surface functionalization of diamond on the interfacial adhesion of copper and diamond in the composite. Oxygen-containing groups were introduced on the diamond surface by a hydrothermal treatment and amino groups were further introduced using a silane coupling agent. Surface functionalization of diamond with both these groups led to drastically increased wettability against the copper sulfate solution and improved the interfacial adhesion of copper and diamond in the composite. Compared with that of the plating based on pristine diamond, the thermal conductivity of the platings based on diamond functionalized with oxygen-containing groups and amino groups increased by 42 and 31 W m^−1 K^−1, respectively. Thus, diamond surface functionalization effectively improved the adhesion at the copper/diamond interface in electroplated copper/diamond composites.", "subitem_description_language": "en", "subitem_description_type": "Abstract"}]}, "item_9_publisher_32": {"attribute_name": "出版者", "attribute_value_mlt": [{"subitem_publisher": "World Scientific", "subitem_publisher_language": "en"}]}, "item_9_relation_43": {"attribute_name": "関連情報", "attribute_value_mlt": [{"subitem_relation_type": "isVersionOf", "subitem_relation_type_id": {"subitem_relation_type_id_text": "https://doi.org/10.1142/S1793604721510231", "subitem_relation_type_select": "DOI"}}]}, "item_9_rights_12": {"attribute_name": "権利", "attribute_value_mlt": [{"subitem_rights": "Electronic version of an article published as [Functional Materials Letters. v.14, n.05, 2021, p.2151023] [http://doi.org/10.1142/S1793604721510231] © [copyright World Scientific Publishing Company] [https://www.worldscientific.com/worldscinet/fml]", "subitem_rights_language": "en"}]}, "item_9_source_id_7": {"attribute_name": "収録物識別子", "attribute_value_mlt": [{"subitem_source_identifier": "1793-6047", "subitem_source_identifier_type": "PISSN"}]}, "item_access_right": {"attribute_name": "アクセス権", "attribute_value_mlt": [{"subitem_access_right": "open access", "subitem_access_right_uri": "http://purl.org/coar/access_right/c_abf2"}]}, "item_creator": {"attribute_name": "著者", "attribute_type": "creator", "attribute_value_mlt": [{"creatorNames": [{"creatorName": "Naruse, Yuto", "creatorNameLang": "en"}]}, {"creatorNames": [{"creatorName": "Park, Jae-Hyeok", "creatorNameLang": "en"}]}, {"creatorNames": [{"creatorName": "Hagio, Tkeshi", "creatorNameLang": "en"}]}, {"creatorNames": [{"creatorName": "Kamimoto, Yuki", "creatorNameLang": "en"}]}, {"creatorNames": [{"creatorName": "Ichino, Ryoichi", "creatorNameLang": "en"}]}, {"creatorNames": [{"creatorName": "Bessho, Takeshi", "creatorNameLang": "en"}]}]}, "item_files": {"attribute_name": "ファイル情報", "attribute_type": "file", "attribute_value_mlt": [{"accessrole": "open_date", "date": [{"dateType": "Available", "dateValue": "2022-05-25"}], "displaytype": "detail", "download_preview_message": "", "file_order": 0, "filename": "Manuscript_FML_revised.pdf", "filesize": [{"value": "657 KB"}], "format": "application/pdf", "future_date_message": "", "is_thumbnail": false, "mimetype": "application/pdf", "size": 657000.0, "url": {"objectType": "fulltext", "url": "https://nagoya.repo.nii.ac.jp/record/2001949/files/Manuscript_FML_revised.pdf"}, "version_id": "9d738261-6857-44a0-a4c4-2529525ff034"}]}, "item_keyword": {"attribute_name": "キーワード", "attribute_value_mlt": [{"subitem_subject": "Copper", "subitem_subject_scheme": "Other"}, {"subitem_subject": "diamond surface modification", "subitem_subject_scheme": "Other"}, {"subitem_subject": "composite platings", "subitem_subject_scheme": "Other"}, {"subitem_subject": "interfacial adhesion", "subitem_subject_scheme": "Other"}, {"subitem_subject": "surface functionalization", "subitem_subject_scheme": "Other"}]}, "item_language": {"attribute_name": "言語", "attribute_value_mlt": [{"subitem_language": "eng"}]}, "item_resource_type": {"attribute_name": "資源タイプ", "attribute_value_mlt": [{"resourcetype": "journal article", "resourceuri": "http://purl.org/coar/resource_type/c_6501"}]}, "item_title": "Electroplating of copper/microdiamond composites and the effect of diamond surface functionalization", "item_titles": {"attribute_name": "タイトル", "attribute_value_mlt": [{"subitem_title": "Electroplating of copper/microdiamond composites and the effect of diamond surface functionalization", "subitem_title_language": "en"}]}, "item_type_id": "40001", "owner": "17", "path": ["1941"], "permalink_uri": "http://hdl.handle.net/2237/0002001949", "pubdate": {"attribute_name": "PubDate", "attribute_value": "2022-01-17"}, "publish_date": "2022-01-17", "publish_status": "0", "recid": "2001949", "relation": {}, "relation_version_is_last": true, "title": ["Electroplating of copper/microdiamond composites and the effect of diamond surface functionalization"], "weko_shared_id": -1}