| Item type |
itemtype_ver1(1) |
| 公開日 |
2022-01-17 |
| タイトル |
|
|
タイトル |
Electroplating of copper/microdiamond composites and the effect of diamond surface functionalization |
|
言語 |
en |
| 著者 |
Naruse, Yuto
Park, Jae-Hyeok
Hagio, Tkeshi
Kamimoto, Yuki
Ichino, Ryoichi
Bessho, Takeshi
|
| アクセス権 |
|
|
アクセス権 |
open access |
|
アクセス権URI |
http://purl.org/coar/access_right/c_abf2 |
| 権利 |
|
|
言語 |
en |
|
権利情報 |
Electronic version of an article published as [Functional Materials Letters. v.14, n.05, 2021, p.2151023] [http://doi.org/10.1142/S1793604721510231] © [copyright World Scientific Publishing Company] [https://www.worldscientific.com/worldscinet/fml] |
| キーワード |
|
|
主題Scheme |
Other |
|
主題 |
Copper |
| キーワード |
|
|
主題Scheme |
Other |
|
主題 |
diamond surface modification |
| キーワード |
|
|
主題Scheme |
Other |
|
主題 |
composite platings |
| キーワード |
|
|
主題Scheme |
Other |
|
主題 |
interfacial adhesion |
| キーワード |
|
|
主題Scheme |
Other |
|
主題 |
surface functionalization |
| 内容記述 |
|
|
内容記述タイプ |
Abstract |
|
内容記述 |
Compositing diamonds with high thermally conductive metals, such as copper, have attracted much attention in recent years. In this study, we prepared copper/diamond composites by electroplating and investigated the effect of the surface functionalization of diamond on the interfacial adhesion of copper and diamond in the composite. Oxygen-containing groups were introduced on the diamond surface by a hydrothermal treatment and amino groups were further introduced using a silane coupling agent. Surface functionalization of diamond with both these groups led to drastically increased wettability against the copper sulfate solution and improved the interfacial adhesion of copper and diamond in the composite. Compared with that of the plating based on pristine diamond, the thermal conductivity of the platings based on diamond functionalized with oxygen-containing groups and amino groups increased by 42 and 31 W m^−1 K^−1, respectively. Thus, diamond surface functionalization effectively improved the adhesion at the copper/diamond interface in electroplated copper/diamond composites. |
|
言語 |
en |
| 出版者 |
|
|
出版者 |
World Scientific |
|
言語 |
en |
| 言語 |
|
|
言語 |
eng |
| 資源タイプ |
|
|
資源タイプ識別子 |
http://purl.org/coar/resource_type/c_6501 |
|
資源タイプ |
journal article |
| 出版タイプ |
|
|
出版タイプ |
AM |
|
出版タイプResource |
http://purl.org/coar/version/c_ab4af688f83e57aa |
| 関連情報 |
|
|
関連タイプ |
isVersionOf |
|
|
識別子タイプ |
DOI |
|
|
関連識別子 |
https://doi.org/10.1142/S1793604721510231 |
| 収録物識別子 |
|
|
収録物識別子タイプ |
PISSN |
|
収録物識別子 |
1793-6047 |
| 書誌情報 |
en : Functional Materials Letters
巻 14,
号 05,
p. 2151023,
発行日 2021-05-25
|
| ファイル公開日 |
|
|
日付 |
2022-05-25 |
|
日付タイプ |
Available |
Manuscript_FML_revised.pdf (657 KB)
