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{"_buckets": {"deposit": "d63c7ff8-b43b-428e-84bf-fc3e31e9638f"}, "_deposit": {"id": "23915", "owners": [], "pid": {"revision_id": 0, "type": "depid", "value": "23915"}, "status": "published"}, "_oai": {"id": "oai:nagoya.repo.nii.ac.jp:00023915", "sets": ["322"]}, "author_link": ["71004", "71005", "71006", "71007", "71008", "71009", "71010"], "item_10_biblio_info_6": {"attribute_name": "書誌情報", "attribute_value_mlt": [{"bibliographicIssueDates": {"bibliographicIssueDate": "2017-01", "bibliographicIssueDateType": "Issued"}, "bibliographicPageEnd": "01A103", "bibliographicPageStart": "01A103", "bibliographicVolumeNumber": "35", "bibliographic_titles": [{"bibliographic_title": "Journal of Vacuum Science \u0026 Technology A: Vacuum, Surfaces, and Films", "bibliographic_titleLang": "en"}]}]}, "item_10_description_4": {"attribute_name": "抄録", "attribute_value_mlt": [{"subitem_description": "This work demonstrated a process for the atomic-scale etching of SiO2 films, consisting of alternating nanometer-thick fluorocarbon film deposition with O2 plasma irradiation in a capacitively coupled plasma reactor. Ar plasma etching after fluorocarbon film deposition tends to suffer from nanometer- or subnanometer-thick carbon films deposited on the SiO2 surface and chamber walls. These carbon films cause various problems, such as reductions in the etching rate per cycle and degradation of the SiO2 quality. In contrast, in our two-step process, O2 plasma removes carbon atoms in such fluorocarbon films. This process therefore allows the atomic scale etching of SiO2 films without any residue or surface contamination. Additionally, since the etching rate per cycle plateaus as both the etching time and deposition time are extended, it is unnecessary to uniformly deposit a fluorocarbon film over the wafer.", "subitem_description_language": "en", "subitem_description_type": "Abstract"}]}, "item_10_identifier_60": {"attribute_name": "URI", "attribute_value_mlt": [{"subitem_identifier_type": "DOI", "subitem_identifier_uri": "http://doi.org/10.1116/1.4971171"}, {"subitem_identifier_type": "HDL", "subitem_identifier_uri": "http://hdl.handle.net/2237/26119"}]}, "item_10_publisher_32": {"attribute_name": "出版者", "attribute_value_mlt": [{"subitem_publisher": "AIP Publishing", "subitem_publisher_language": "en"}]}, "item_10_relation_11": {"attribute_name": "DOI", "attribute_value_mlt": [{"subitem_relation_type": "isVersionOf", "subitem_relation_type_id": {"subitem_relation_type_id_text": "https://doi.org/10.1116/1.4971171", "subitem_relation_type_select": "DOI"}}]}, "item_10_rights_12": {"attribute_name": "権利", "attribute_value_mlt": [{"subitem_rights": "Copyright 2017 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing.The following article appeared in (Journal of Vacuum Science \u0026 Technology A: Vacuum, Surfaces, and Films. v.35, 2017, p.01A103) and may be found at (http://dx.doi.org/10.1116/1.4971171).", "subitem_rights_language": "en"}]}, "item_10_select_15": {"attribute_name": "著者版フラグ", "attribute_value_mlt": [{"subitem_select_item": "publisher"}]}, "item_10_source_id_7": {"attribute_name": "ISSN", "attribute_value_mlt": [{"subitem_source_identifier": "0734-2101", "subitem_source_identifier_type": "PISSN"}]}, "item_1615787544753": {"attribute_name": "出版タイプ", "attribute_value_mlt": [{"subitem_version_resource": "http://purl.org/coar/version/c_970fb48d4fbd8a85", "subitem_version_type": "VoR"}]}, "item_access_right": {"attribute_name": "アクセス権", "attribute_value_mlt": [{"subitem_access_right": "open access", "subitem_access_right_uri": "http://purl.org/coar/access_right/c_abf2"}]}, "item_creator": {"attribute_name": "著者", "attribute_type": "creator", "attribute_value_mlt": [{"creatorNames": [{"creatorName": "Tsutsumi, Takayoshi", "creatorNameLang": "en"}], "nameIdentifiers": [{"nameIdentifier": "71004", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Kondo, Hiroki", "creatorNameLang": "en"}], "nameIdentifiers": [{"nameIdentifier": "71005", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Hori, Masaru", "creatorNameLang": "en"}], "nameIdentifiers": [{"nameIdentifier": "71006", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Zaitsu, Masaru", "creatorNameLang": "en"}], "nameIdentifiers": [{"nameIdentifier": "71007", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Kobayashi, Akiko", "creatorNameLang": "en"}], "nameIdentifiers": [{"nameIdentifier": "71008", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Nozawa, Toshihisa", "creatorNameLang": "en"}], "nameIdentifiers": [{"nameIdentifier": "71009", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Kobayashi, Nobuyoshi", "creatorNameLang": "en"}], "nameIdentifiers": [{"nameIdentifier": "71010", "nameIdentifierScheme": "WEKO"}]}]}, "item_files": {"attribute_name": "ファイル情報", "attribute_type": "file", "attribute_value_mlt": [{"accessrole": "open_date", "date": [{"dateType": "Available", "dateValue": "2018-01-01"}], "displaytype": "detail", "download_preview_message": "", "file_order": 0, "filename": "1_E4971171.pdf", "filesize": [{"value": "905.5 kB"}], "format": "application/pdf", "future_date_message": "", "is_thumbnail": false, "licensetype": "license_note", "mimetype": "application/pdf", "size": 905500.0, "url": {"label": "1_E4971171.pdf ファイル公開:2018/01/01", "objectType": "fulltext", "url": "https://nagoya.repo.nii.ac.jp/record/23915/files/1_E4971171.pdf"}, "version_id": "e74379f3-9e3f-47bf-b359-ef18fc42b30c"}]}, "item_language": {"attribute_name": "言語", "attribute_value_mlt": [{"subitem_language": "eng"}]}, "item_resource_type": {"attribute_name": "資源タイプ", "attribute_value_mlt": [{"resourcetype": "journal article", "resourceuri": "http://purl.org/coar/resource_type/c_6501"}]}, "item_title": "Atomic layer etching of SiO2 by alternating an O2 plasma with fluorocarbon film deposition", "item_titles": {"attribute_name": "タイトル", "attribute_value_mlt": [{"subitem_title": "Atomic layer etching of SiO2 by alternating an O2 plasma with fluorocarbon film deposition", "subitem_title_language": "en"}]}, "item_type_id": "10", "owner": "1", "path": ["322"], "permalink_uri": "http://hdl.handle.net/2237/26119", "pubdate": {"attribute_name": "PubDate", "attribute_value": "2017-04-21"}, "publish_date": "2017-04-21", "publish_status": "0", "recid": "23915", "relation": {}, "relation_version_is_last": true, "title": ["Atomic layer etching of SiO2 by alternating an O2 plasma with fluorocarbon film deposition"], "weko_shared_id": -1}
Atomic layer etching of SiO2 by alternating an O2 plasma with fluorocarbon film deposition
http://hdl.handle.net/2237/26119
http://hdl.handle.net/2237/26119dc139b89-a531-449c-845f-045de3e7658c
名前 / ファイル | ライセンス | アクション |
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1_E4971171.pdf ファイル公開:2018/01/01 (905.5 kB)
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Item type | 学術雑誌論文 / Journal Article(1) | |||||
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公開日 | 2017-04-21 | |||||
タイトル | ||||||
タイトル | Atomic layer etching of SiO2 by alternating an O2 plasma with fluorocarbon film deposition | |||||
言語 | en | |||||
著者 |
Tsutsumi, Takayoshi
× Tsutsumi, Takayoshi× Kondo, Hiroki× Hori, Masaru× Zaitsu, Masaru× Kobayashi, Akiko× Nozawa, Toshihisa× Kobayashi, Nobuyoshi |
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アクセス権 | ||||||
アクセス権 | open access | |||||
アクセス権URI | http://purl.org/coar/access_right/c_abf2 | |||||
権利 | ||||||
言語 | en | |||||
権利情報 | Copyright 2017 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing.The following article appeared in (Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. v.35, 2017, p.01A103) and may be found at (http://dx.doi.org/10.1116/1.4971171). | |||||
抄録 | ||||||
内容記述 | This work demonstrated a process for the atomic-scale etching of SiO2 films, consisting of alternating nanometer-thick fluorocarbon film deposition with O2 plasma irradiation in a capacitively coupled plasma reactor. Ar plasma etching after fluorocarbon film deposition tends to suffer from nanometer- or subnanometer-thick carbon films deposited on the SiO2 surface and chamber walls. These carbon films cause various problems, such as reductions in the etching rate per cycle and degradation of the SiO2 quality. In contrast, in our two-step process, O2 plasma removes carbon atoms in such fluorocarbon films. This process therefore allows the atomic scale etching of SiO2 films without any residue or surface contamination. Additionally, since the etching rate per cycle plateaus as both the etching time and deposition time are extended, it is unnecessary to uniformly deposit a fluorocarbon film over the wafer. | |||||
言語 | en | |||||
内容記述タイプ | Abstract | |||||
出版者 | ||||||
言語 | en | |||||
出版者 | AIP Publishing | |||||
言語 | ||||||
言語 | eng | |||||
資源タイプ | ||||||
資源タイプresource | http://purl.org/coar/resource_type/c_6501 | |||||
タイプ | journal article | |||||
出版タイプ | ||||||
出版タイプ | VoR | |||||
出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
DOI | ||||||
関連タイプ | isVersionOf | |||||
識別子タイプ | DOI | |||||
関連識別子 | https://doi.org/10.1116/1.4971171 | |||||
ISSN | ||||||
収録物識別子タイプ | PISSN | |||||
収録物識別子 | 0734-2101 | |||||
書誌情報 |
en : Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 巻 35, p. 01A103-01A103, 発行日 2017-01 |
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著者版フラグ | ||||||
値 | publisher | |||||
URI | ||||||
識別子 | http://doi.org/10.1116/1.4971171 | |||||
識別子タイプ | DOI | |||||
URI | ||||||
識別子 | http://hdl.handle.net/2237/26119 | |||||
識別子タイプ | HDL |