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Nanowire surface fastener fabrication on flexible substrate
http://hdl.handle.net/2237/00029281
http://hdl.handle.net/2237/00029281bad7cd2c-190d-40a0-bc0d-ef39486eb143
名前 / ファイル | ライセンス | アクション |
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Item type | 学術雑誌論文 / Journal Article(1) | |||||
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公開日 | 2019-02-12 | |||||
タイトル | ||||||
タイトル | Nanowire surface fastener fabrication on flexible substrate | |||||
言語 | en | |||||
著者 |
Toku, Yuhki
× Toku, Yuhki× Uchida, Keita× Morita, Yasuyuki× Ju, Yang |
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アクセス権 | ||||||
アクセス権 | open access | |||||
アクセス権URI | http://purl.org/coar/access_right/c_abf2 | |||||
権利 | ||||||
言語 | en | |||||
権利情報 | This is an author-created, un-copyedited version of an article published in {Nanotechnology}. IOP Publishing Ltd is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at {https://doi.org/10.1088/1361-6528/aac284}. “This Accepted Manuscript is available for reuse under a CC BY-NC-ND 3.0 licence after the 12 month embargo period provided that all the terms of the licence are adhered to” | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Nanowire | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Nanowire surface fastener | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Surface mount technique | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Porous material | |||||
キーワード | ||||||
主題Scheme | Other | |||||
主題 | Flexible substrate | |||||
抄録 | ||||||
内容記述 | The market for wearable devices has increased considerably in recent years. In response to this demand, flexible electronic circuit technology has become more important. The conventional bonding technology in electronic assembly depends on high-temperature processes such as reflow soldering, which result in undesired thermal damages and residual stress at a bonding interface. In addition, it exhibits poor compatibility with bendable or stretchable device applications. Therefore, there is an urgent requirement to attach electronic parts on printed circuit boards with good mechanical and electrical properties at room temperature. Nanowire surface fasteners (NSFs) are candidates for resolving these problems. This paper describes the fabrication of an NSF on a flexible substrate, which can be used for room temperature conductive bonding. The template method is used for preparing high-density nanowire arrays. A Cu thin film is layered on the template as the flexible substrate. After etching the template, a Cu NSF is obtained on the Cu film substrate. In addition, the electrical and mechanical properties of the Cu NSF are studied under various fabrication conditions. The Cu NSF exhibits high shear adhesion strength (~234 N cm^−2) and low contact resistivity (2.2 × 10^−4 Ω cm2). | |||||
言語 | en | |||||
内容記述タイプ | Abstract | |||||
内容記述 | ||||||
内容記述 | ファイル公開:2019-07-27 | |||||
言語 | ja | |||||
内容記述タイプ | Other | |||||
出版者 | ||||||
言語 | en | |||||
出版者 | IOP publishing | |||||
言語 | ||||||
言語 | eng | |||||
資源タイプ | ||||||
資源タイプresource | http://purl.org/coar/resource_type/c_6501 | |||||
タイプ | journal article | |||||
出版タイプ | ||||||
出版タイプ | AM | |||||
出版タイプResource | http://purl.org/coar/version/c_ab4af688f83e57aa | |||||
DOI | ||||||
関連タイプ | isVersionOf | |||||
識別子タイプ | DOI | |||||
関連識別子 | https://doi.org/10.1088/1361-6528/aac284 | |||||
ISSN(print) | ||||||
収録物識別子タイプ | PISSN | |||||
収録物識別子 | 0957-4484 | |||||
書誌情報 |
en : Nanotechnology 巻 29, 号 30, p. 305702, 発行日 2018-07-27 |
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著者版フラグ | ||||||
値 | author |