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  1. B200 工学部/工学研究科
  2. B200a 雑誌掲載論文
  3. 学術雑誌

Nanowire surface fastener fabrication on flexible substrate

http://hdl.handle.net/2237/00029281
http://hdl.handle.net/2237/00029281
bad7cd2c-190d-40a0-bc0d-ef39486eb143
名前 / ファイル ライセンス アクション
Manu_R1_final.pdf Manu_R1_final (1.3 MB)
Item type 学術雑誌論文 / Journal Article(1)
公開日 2019-02-12
タイトル
タイトル Nanowire surface fastener fabrication on flexible substrate
言語 en
著者 Toku, Yuhki

× Toku, Yuhki

WEKO 88789

en Toku, Yuhki

Search repository
Uchida, Keita

× Uchida, Keita

WEKO 88790

en Uchida, Keita

Search repository
Morita, Yasuyuki

× Morita, Yasuyuki

WEKO 88791

en Morita, Yasuyuki

Search repository
Ju, Yang

× Ju, Yang

WEKO 88792

en Ju, Yang

Search repository
アクセス権
アクセス権 open access
アクセス権URI http://purl.org/coar/access_right/c_abf2
権利
言語 en
権利情報 This is an author-created, un-copyedited version of an article published in {Nanotechnology}. IOP Publishing Ltd is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at {https://doi.org/10.1088/1361-6528/aac284}. “This Accepted Manuscript is available for reuse under a CC BY-NC-ND 3.0 licence after the 12 month embargo period provided that all the terms of the licence are adhered to”
キーワード
主題Scheme Other
主題 Nanowire
キーワード
主題Scheme Other
主題 Nanowire surface fastener
キーワード
主題Scheme Other
主題 Surface mount technique
キーワード
主題Scheme Other
主題 Porous material
キーワード
主題Scheme Other
主題 Flexible substrate
抄録
内容記述 The market for wearable devices has increased considerably in recent years. In response to this demand, flexible electronic circuit technology has become more important. The conventional bonding technology in electronic assembly depends on high-temperature processes such as reflow soldering, which result in undesired thermal damages and residual stress at a bonding interface. In addition, it exhibits poor compatibility with bendable or stretchable device applications. Therefore, there is an urgent requirement to attach electronic parts on printed circuit boards with good mechanical and electrical properties at room temperature. Nanowire surface fasteners (NSFs) are candidates for resolving these problems. This paper describes the fabrication of an NSF on a flexible substrate, which can be used for room temperature conductive bonding. The template method is used for preparing high-density nanowire arrays. A Cu thin film is layered on the template as the flexible substrate. After etching the template, a Cu NSF is obtained on the Cu film substrate. In addition, the electrical and mechanical properties of the Cu NSF are studied under various fabrication conditions. The Cu NSF exhibits high shear adhesion strength (~234 N cm^−2) and low contact resistivity (2.2 × 10^−4 Ω cm2).
言語 en
内容記述タイプ Abstract
内容記述
内容記述 ファイル公開:2019-07-27
言語 ja
内容記述タイプ Other
出版者
言語 en
出版者 IOP publishing
言語
言語 eng
資源タイプ
資源タイプresource http://purl.org/coar/resource_type/c_6501
タイプ journal article
出版タイプ
出版タイプ AM
出版タイプResource http://purl.org/coar/version/c_ab4af688f83e57aa
DOI
関連タイプ isVersionOf
識別子タイプ DOI
関連識別子 https://doi.org/10.1088/1361-6528/aac284
ISSN(print)
収録物識別子タイプ PISSN
収録物識別子 0957-4484
書誌情報 en : Nanotechnology

巻 29, 号 30, p. 305702, 発行日 2018-07-27
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