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On the stress measurement method using grain growth process of electrodeposited copper foil
https://doi.org/10.18999/memfenu.39.1.155
https://doi.org/10.18999/memfenu.39.1.15592397a06-7130-4c1d-bebc-0526b708c0f7
名前 / ファイル | ライセンス | アクション |
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39-1-05.pdf (1.2 MB)
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Item type | 紀要論文 / Departmental Bulletin Paper(1) | |||||
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公開日 | 2020-10-29 | |||||
タイトル | ||||||
タイトル | On the stress measurement method using grain growth process of electrodeposited copper foil | |||||
言語 | en | |||||
著者 |
Kitaoka, Seiichiro
× Kitaoka, Seiichiro× Ohshima, Kazuhiko |
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アクセス権 | ||||||
アクセス権 | open access | |||||
アクセス権URI | http://purl.org/coar/access_right/c_abf2 | |||||
抄録 | ||||||
内容記述 | Using electrodeposited copper foil, the relation between the magnitude of cyclic stress and the number of cycles for the initiation of grain growth and the threshold stresses for grain nucleation and grain growth were examined. On the basis of the test results, the possibility of the stress measurement using grain growth process was investigated. The threshold stress of grain growth is remarkably lower than that of grain nucleation and the former is controlled by the amplitude of shearing stress as well as the latter. So, taking notice of the phenomenon of grain growth threshold, stress measurement can be done under lower strain amplitude compared with the electroplating method used until now. | |||||
言語 | en | |||||
内容記述タイプ | Abstract | |||||
出版者 | ||||||
言語 | en | |||||
出版者 | Faculty of Engineering, Nagoya University | |||||
言語 | ||||||
言語 | eng | |||||
資源タイプ | ||||||
資源 | http://purl.org/coar/resource_type/c_6501 | |||||
タイプ | departmental bulletin paper | |||||
出版タイプ | ||||||
出版タイプ | VoR | |||||
出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
ID登録 | ||||||
ID登録 | 10.18999/memfenu.39.1.155 | |||||
ID登録タイプ | JaLC | |||||
ISSN(print) | ||||||
収録物識別子タイプ | PISSN | |||||
収録物識別子 | 0027-7657 | |||||
書誌情報 |
en : Memoirs of the Faculty of Engineering, Nagoya University 巻 39, 号 1, p. 155-162, 発行日 1987-10-31 |
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著者版フラグ | ||||||
値 | publisher |