{"_buckets": {"deposit": "35149b2b-1425-4775-8af1-ffa498d48d9a"}, "_deposit": {"id": "30761", "owners": [], "pid": {"revision_id": 0, "type": "depid", "value": "30761"}, "status": "published"}, "_oai": {"id": "oai:nagoya.repo.nii.ac.jp:00030761", "sets": []}, "author_link": ["102037", "102038"], "item_9_biblio_info_6": {"attribute_name": "\u66f8\u8a8c\u60c5\u5831", "attribute_value_mlt": [{"bibliographicIssueDates": {"bibliographicIssueDate": "1987-10-31", "bibliographicIssueDateType": "Issued"}, "bibliographicIssueNumber": "1", "bibliographicPageEnd": "162", "bibliographicPageStart": "155", "bibliographicVolumeNumber": "39", "bibliographic_titles": [{"bibliographic_title": "Memoirs of the Faculty of Engineering, Nagoya University"}]}]}, "item_9_description_4": {"attribute_name": "\u6284\u9332", "attribute_value_mlt": [{"subitem_description": "Using electrodeposited copper foil, the relation between the magnitude of cyclic stress and the number of cycles for the initiation of grain growth and the threshold stresses for grain nucleation and grain growth were examined. On the basis of the test results, the possibility of the stress measurement using grain growth process was investigated. The threshold stress of grain growth is remarkably lower than that of grain nucleation and the former is controlled by the amplitude of shearing stress as well as the latter. So, taking notice of the phenomenon of grain growth threshold, stress measurement can be done under lower strain amplitude compared with the electroplating method used until now.", "subitem_description_language": "en", "subitem_description_type": "Abstract"}]}, "item_9_identifier_registration": {"attribute_name": "ID\u767b\u9332", "attribute_value_mlt": [{"subitem_identifier_reg_text": "10.18999/memfenu.39.1.155", "subitem_identifier_reg_type": "JaLC"}]}, "item_9_publisher_32": {"attribute_name": "\u51fa\u7248\u8005", "attribute_value_mlt": [{"subitem_publisher": "Faculty of Engineering, Nagoya University"}]}, "item_9_select_15": {"attribute_name": "\u8457\u8005\u7248\u30d5\u30e9\u30b0", "attribute_value_mlt": [{"subitem_select_item": "publisher"}]}, "item_9_source_id_7": {"attribute_name": "ISSN\uff08print\uff09", "attribute_value_mlt": [{"subitem_source_identifier": "0027-7657", "subitem_source_identifier_type": "PISSN"}]}, "item_creator": {"attribute_name": "\u8457\u8005", "attribute_type": "creator", "attribute_value_mlt": [{"creatorNames": [{"creatorName": "Kitaoka, Seiichiro", "creatorNameLang": "en"}], "nameIdentifiers": [{"nameIdentifier": "102037", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Ohshima, Kazuhiko", "creatorNameLang": "en"}], "nameIdentifiers": [{"nameIdentifier": "102038", "nameIdentifierScheme": "WEKO"}]}]}, "item_files": {"attribute_name": "\u30d5\u30a1\u30a4\u30eb\u60c5\u5831", "attribute_type": "file", "attribute_value_mlt": [{"accessrole": "open_date", "date": [{"dateType": "Available", "dateValue": "2020-10-29"}], "displaytype": "detail", "download_preview_message": "", "file_order": 0, "filename": "39-1-05.pdf", "filesize": [{"value": "1.2 MB"}], "format": "application/pdf", "future_date_message": "", "is_thumbnail": false, "licensetype": "license_note", "mimetype": "application/pdf", "size": 1200000.0, "url": {"label": "39-1-05.pdf", "url": "https://nagoya.repo.nii.ac.jp/record/30761/files/39-1-05.pdf"}, "version_id": "83d0da35-ac40-49c8-bcd1-ca203042bcc0"}]}, "item_language": {"attribute_name": "\u8a00\u8a9e", "attribute_value_mlt": [{"subitem_language": "eng"}]}, "item_resource_type": {"attribute_name": "\u8cc7\u6e90\u30bf\u30a4\u30d7", "attribute_value_mlt": [{"resourcetype": "departmental bulletin paper", "resourceuri": "http://purl.org/coar/resource_type/c_6501"}]}, "item_title": "On the stress measurement method using grain growth process of electrodeposited copper foil", "item_titles": {"attribute_name": "\u30bf\u30a4\u30c8\u30eb", "attribute_value_mlt": [{"subitem_title": "On the stress measurement method using grain growth process of electrodeposited copper foil", "subitem_title_language": "en"}]}, "item_type_id": "9", "owner": "1", "path": ["320/2524/2544/2554"], "permalink_uri": "https://doi.org/10.18999/memfenu.39.1.155", "pubdate": {"attribute_name": "PubDate", "attribute_value": "2020-10-29"}, "publish_date": "2020-10-29", "publish_status": "0", "recid": "30761", "relation": {}, "relation_version_is_last": true, "title": ["On the stress measurement method using grain growth process of electrodeposited copper foil"], "weko_shared_id": -1}