{"_buckets": {"deposit": "87b72d41-19ef-485f-8f85-49d37fe9060c"}, "_deposit": {"id": "7718", "owners": [], "pid": {"revision_id": 0, "type": "depid", "value": "7718"}, "status": "published"}, "_oai": {"id": "oai:nagoya.repo.nii.ac.jp:00007718"}, "item_10_biblio_info_6": {"attribute_name": "\u66f8\u8a8c\u60c5\u5831", "attribute_value_mlt": [{"bibliographicIssueDates": {"bibliographicIssueDate": "2007", "bibliographicIssueDateType": "Issued"}, "bibliographicPageEnd": "504", "bibliographicPageStart": "499", "bibliographic_titles": [{"bibliographic_title": "International Symposium on Micro-NanoMechatronics and Human Science"}]}]}, "item_10_description_4": {"attribute_name": "\u6284\u9332", "attribute_value_mlt": [{"subitem_description": "In this work, we have developed a novel anisotropic wet etching process for the fabrication of MEMS microstructures with rounded concave and sharp convex corners, grooves for chip isolation, mesa structures with bent V-grooves, and 45\u00b0mirrors by using a single etching mask. Tetra Methyl Ammonium Hydroxide (TMAH) at various concentrations with and without the non-ionic surfactant NC-200 at 0.1\uff05 of the total volume of the etchant has been used. In order to fabricate the microstructures with rounded concave corners, round shape mask pattern was used. Mesa structures and grooves for chip isolation were realized using spatially efficient convex corner compensation structures.", "subitem_description_type": "Abstract"}]}, "item_10_identifier_60": {"attribute_name": "URI", "attribute_value_mlt": [{"subitem_identifier_type": "HDL", "subitem_identifier_uri": "http://hdl.handle.net/2237/9437"}]}, "item_10_publisher_32": {"attribute_name": "\u51fa\u7248\u8005", "attribute_value_mlt": [{"subitem_publisher": "IEEE"}]}, "item_10_relation_11": {"attribute_name": "DOI", "attribute_value_mlt": [{"subitem_relation_type_id": {"subitem_relation_type_id_text": "http://dx.doi.org/10.1109/MHS.2007.4420906", "subitem_relation_type_select": "DOI"}}]}, "item_10_relation_8": {"attribute_name": "ISBN", "attribute_value_mlt": [{"subitem_relation_type_id": {"subitem_relation_type_id_text": "978-1-4244-1858-9", "subitem_relation_type_select": "ISBN"}}]}, "item_10_rights_12": {"attribute_name": "\u6a29\u5229", "attribute_value_mlt": [{"subitem_rights": "Copyright \u00a9 2007 IEEE. Reprinted from (relevant publication info). This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Nagoya University\u2019s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org."}]}, "item_10_select_15": {"attribute_name": "\u8457\u8005\u7248\u30d5\u30e9\u30b0", "attribute_value_mlt": [{"subitem_select_item": "publisher"}]}, "item_10_text_14": {"attribute_name": "\u30d5\u30a9\u30fc\u30de\u30c3\u30c8", "attribute_value_mlt": [{"subitem_text_value": "application/pdf"}]}, "item_creator": {"attribute_name": "\u8457\u8005", "attribute_type": "creator", "attribute_value_mlt": [{"creatorNames": [{"creatorName": "Pal, Prem"}], "nameIdentifiers": [{"nameIdentifier": "21873", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Sato, Kazuo"}], "nameIdentifiers": [{"nameIdentifier": "21874", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Gosalvez, Miguel A."}], "nameIdentifiers": [{"nameIdentifier": "21875", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Shikida, Mitsuhiro"}], "nameIdentifiers": [{"nameIdentifier": "21876", "nameIdentifierScheme": "WEKO"}]}]}, "item_files": {"attribute_name": "\u30d5\u30a1\u30a4\u30eb\u60c5\u5831", "attribute_type": "file", "attribute_value_mlt": [{"accessrole": "open_date", "date": [{"dateType": "Available", "dateValue": "2018-02-19"}], "displaytype": "detail", "download_preview_message": "", "file_order": 0, "filename": "sato_499.pdf", "filesize": [{"value": "4.1 MB"}], "format": "application/pdf", "future_date_message": "", "is_thumbnail": false, "licensetype": "license_free", "mimetype": "application/pdf", "size": 4099999.9999999995, "url": {"label": "sato_499.pdf", "url": "https://nagoya.repo.nii.ac.jp/record/7718/files/sato_499.pdf"}, "version_id": "b6fbc3cb-bbb6-47dc-ae1c-a5cb7f49d499"}]}, "item_language": {"attribute_name": "\u8a00\u8a9e", "attribute_value_mlt": [{"subitem_language": "eng"}]}, "item_resource_type": {"attribute_name": "\u8cc7\u6e90\u30bf\u30a4\u30d7", "attribute_value_mlt": [{"resourcetype": "journal article", "resourceuri": "http://purl.org/coar/resource_type/c_6501"}]}, "item_title": "Novel Wet Anisotropic Etching Process for the Realization of New Shapes of Silicon MEMS Structures", "item_titles": {"attribute_name": "\u30bf\u30a4\u30c8\u30eb", "attribute_value_mlt": [{"subitem_title": "Novel Wet Anisotropic Etching Process for the Realization of New Shapes of Silicon MEMS Structures"}]}, "item_type_id": "10", "owner": "1", "path": ["320/321/322"], "permalink_uri": "http://hdl.handle.net/2237/9437", "pubdate": {"attribute_name": "\u516c\u958b\u65e5", "attribute_name_i18n": "\u516c\u958b\u65e5", "attribute_value": "2008-02-21"}, "publish_date": "2008-02-21", "publish_status": "0", "recid": "7718", "relation": {}, "relation_version_is_last": true, "title": ["Novel Wet Anisotropic Etching Process for the Realization of New Shapes of Silicon MEMS Structures"], "weko_shared_id": 3}