{"_buckets": {"deposit": "4c17baa3-8c63-468a-a768-7b4f8b0ab203"}, "_deposit": {"id": "12038", "owners": [], "pid": {"revision_id": 0, "type": "depid", "value": "12038"}, "status": "published"}, "_oai": {"id": "oai:nagoya.repo.nii.ac.jp:00012038"}, "item_10_biblio_info_6": {"attribute_name": "\u66f8\u8a8c\u60c5\u5831", "attribute_value_mlt": [{"bibliographicIssueDates": {"bibliographicIssueDate": "2009-11-09", "bibliographicIssueDateType": "Issued"}, "bibliographicPageEnd": "558", "bibliographicPageStart": "553", "bibliographic_titles": [{"bibliographic_title": "International Symposium on Micro-NanoMechatronics and Human Science (MHS 2009)"}]}]}, "item_10_description_4": {"attribute_name": "\u6284\u9332", "attribute_value_mlt": [{"subitem_description": "The present research reports the fabrication techniques for the formation of complex three dimensional structures. The process is developed using very economic wet anisotropic etching in pure and surfactant Triton X-100 [C14H22O(C2H4O)n, n= 9-10] added 25 wt% tetramethyl ammonium hydroxide (TMAH) solutions. The structures are fabricated in single and nitride-based silicon on insulator (SOI) Si{100} wafers. In single wafer, both fixed and suspended structures are manufactured, while in SOI wafers only freestanding structures are realized. The present research is aimed to enhance the range of 3D structures fabricated using wet etching.", "subitem_description_type": "Abstract"}]}, "item_10_identifier_60": {"attribute_name": "URI", "attribute_value_mlt": [{"subitem_identifier_type": "HDL", "subitem_identifier_uri": "http://hdl.handle.net/2237/13914"}, {"subitem_identifier_type": "DOI", "subitem_identifier_uri": "http://dx.doi.org/10.1109/MHS.2009.5351788"}]}, "item_10_publisher_32": {"attribute_name": "\u51fa\u7248\u8005", "attribute_value_mlt": [{"subitem_publisher": "IEEE"}]}, "item_10_relation_8": {"attribute_name": "ISBN", "attribute_value_mlt": [{"subitem_relation_type_id": {"subitem_relation_type_id_text": "978-1-4244-5094-7", "subitem_relation_type_select": "ISBN"}}]}, "item_10_rights_12": {"attribute_name": "\u6a29\u5229", "attribute_value_mlt": [{"subitem_rights": "\u00a92009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE."}]}, "item_10_select_15": {"attribute_name": "\u8457\u8005\u7248\u30d5\u30e9\u30b0", "attribute_value_mlt": [{"subitem_select_item": "publisher"}]}, "item_10_text_14": {"attribute_name": "\u30d5\u30a9\u30fc\u30de\u30c3\u30c8", "attribute_value_mlt": [{"subitem_text_value": "application/pdf"}]}, "item_creator": {"attribute_name": "\u8457\u8005", "attribute_type": "creator", "attribute_value_mlt": [{"creatorNames": [{"creatorName": "Pal, Prem"}], "nameIdentifiers": [{"nameIdentifier": "38175", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Sato, Kazuo"}], "nameIdentifiers": [{"nameIdentifier": "38176", "nameIdentifierScheme": "WEKO"}]}]}, "item_files": {"attribute_name": "\u30d5\u30a1\u30a4\u30eb\u60c5\u5831", "attribute_type": "file", "attribute_value_mlt": [{"accessrole": "open_date", "date": [{"dateType": "Available", "dateValue": "2018-02-20"}], "displaytype": "detail", "download_preview_message": "", "file_order": 0, "filename": "09_MHS_Prem.pdf", "filesize": [{"value": "793.1 kB"}], "format": "application/pdf", "future_date_message": "", "is_thumbnail": false, "licensetype": "license_free", "mimetype": "application/pdf", "size": 793100.0, "url": {"label": "09_MHS_Prem.pdf", "url": "https://nagoya.repo.nii.ac.jp/record/12038/files/09_MHS_Prem.pdf"}, "version_id": "e06224df-6346-4ed8-8414-7fc75fecccb4"}]}, "item_language": {"attribute_name": "\u8a00\u8a9e", "attribute_value_mlt": [{"subitem_language": "eng"}]}, "item_resource_type": {"attribute_name": "\u8cc7\u6e90\u30bf\u30a4\u30d7", "attribute_value_mlt": [{"resourcetype": "journal article", "resourceuri": "http://purl.org/coar/resource_type/c_6501"}]}, "item_title": "Wet etched complex three dimensional MEMS structures", "item_titles": {"attribute_name": "\u30bf\u30a4\u30c8\u30eb", "attribute_value_mlt": [{"subitem_title": "Wet etched complex three dimensional MEMS structures"}]}, "item_type_id": "10", "owner": "1", "path": ["320/321/322"], "permalink_uri": "http://hdl.handle.net/2237/13914", "pubdate": {"attribute_name": "\u516c\u958b\u65e5", "attribute_name_i18n": "\u516c\u958b\u65e5", "attribute_value": "2010-08-02"}, "publish_date": "2010-08-02", "publish_status": "0", "recid": "12038", "relation": {}, "relation_version_is_last": true, "title": ["Wet etched complex three dimensional MEMS structures"], "weko_shared_id": null}