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  1. B200 工学部/工学研究科
  2. B200a 雑誌掲載論文
  3. 学術雑誌

RFスパッタ形成したSi酸化膜を用いたMIMキャパシタの抵抗変化特性(ゲート絶縁薄膜,容量膜,機能膜及びメモリ技術)

http://hdl.handle.net/2237/23571
a052fa68-a09d-4c08-9cc5-65ec51ca0ec5
名前 / ファイル ライセンス アクション
110008800863.pdf 110008800863.pdf (828.4 kB)
Item type 学術雑誌論文 / Journal Article(1)
公開日 2016-02-24
タイトル
タイトル RFスパッタ形成したSi酸化膜を用いたMIMキャパシタの抵抗変化特性(ゲート絶縁薄膜,容量膜,機能膜及びメモリ技術)
その他のタイトル
その他のタイトル Resistive Switching Properties of Si-Oxide Thin Films Prepared by RF Sputtering
著者 大田, 晃生

× 大田, 晃生

WEKO 62256

大田, 晃生

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後藤, 優太

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WEKO 62257

後藤, 優太

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西垣, 慎吾

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WEKO 62258

西垣, 慎吾

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尉, 国浜

× 尉, 国浜

WEKO 62259

尉, 国浜

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村上, 秀樹

× 村上, 秀樹

WEKO 62260

村上, 秀樹

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東, 清一郎

× 東, 清一郎

WEKO 62261

東, 清一郎

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宮崎, 誠一

× 宮崎, 誠一

WEKO 62262

宮崎, 誠一

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Ohta, A.

× Ohta, A.

WEKO 62263

Ohta, A.

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Goto, Y.

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WEKO 62264

Goto, Y.

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Nishigaki, S.

× Nishigaki, S.

WEKO 62265

Nishigaki, S.

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Wei, G.

× Wei, G.

WEKO 62266

Wei, G.

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Murakami, H.

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Murakami, H.

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Higashi, S.

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Higashi, S.

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Miyazaki, S.

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Miyazaki, S.

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権利
権利情報 (c)一般社団法人電子情報通信学会 本文データは学協会の許諾に基づきCiNiiから複製したものである
キーワード
主題Scheme Other
主題 抵抗変化型メモリ(ReRAM)
キーワード
主題Scheme Other
主題 Si酸化膜
キーワード
主題Scheme Other
主題 Pt電極
キーワード
主題Scheme Other
主題 RFスパッタリング
キーワード
主題Scheme Other
主題 Resistive Random Access Memory(ReRAM)
キーワード
主題Scheme Other
主題 Si Oxide
キーワード
主題Scheme Other
主題 Pt Electrode
キーワード
主題Scheme Other
主題 RF Sputtering
抄録
内容記述 RFスパッタにより形成したSiO_x厚さ:8〜40nm)をPt電極で挟んだMIMキャパシタにおいて、電圧掃引による電流変化から抵抗変化動作を評価した。フォーミングと呼ばれる絶縁破壊に類似した初期低抵抗化の後、高抵抗状態(High Resistance State:HRS)と低抵抗状態(Low Resistance State:LRS)を繰り返すノンポーラ型のスイッチングを観測した。SiO_x膜厚が20nm以上の領域では、フォーミング電圧は膜厚に対しほぼ線形に増大し、〜2MV/cmでほぼ一定であった。また、SiO_xを用いたReRAMでは、同様の条件で作成したTiO_xに比べ、ON/OFF比の高い抵抗変化動作を観測した。p型およびn型Si基板上に作製したMOS構造では、n型基板を用いた試料に正電圧印加した場合のみに抵抗変化特性が確認され、Pt/SiO_x界面への電子注入と酸素欠陥により抵抗変化が誘起される可能性が示唆された。Resistance-switching properties of RF sputtered Si-rich oxides sandwiching with Pt electrodes have been studided in comparison to the TiO_x case. By sweeping bias to the top Pt electrode, non-polar type resistance-switching behavior was observed after a forming process. In SiO_x thickenss region from 20 to 40nm, the electrical field for the forming process was almost constant at 〜2MV/cm. The current levels in both the high resistance state (HRS) and the low resistance state (LRS) for Pt/SiO_x/Pt were markedly smaller than those for the Pt/TiO_x/Pt structure. And, even with decreasing SiO_x thickness down to 〜8nm, the ON/OFF ratio in resistance-switching between HRS and LRS was maintained to be as large as 〜10^3. The current-voltage characteristics for Pt/SiO_x on p-Si(100) and n-Si(100) suggest that the reduction and oxidation reaction induced by electron fluence near the Pt/SiO_x interface is responsible for obtaining the resistance-switching behavior.
内容記述タイプ Abstract
出版者
出版者 一般社団法人電子情報通信学会
言語
言語 jpn
資源タイプ
資源タイプresource http://purl.org/coar/resource_type/c_6501
タイプ journal article
ISSN
収録物識別子タイプ ISSN
収録物識別子 09135685
書誌情報 電子情報通信学会技術研究報告. SDM, シリコン材料・デバイス

巻 111, 号 114, p. 97-102, 発行日 2011-06-27
著者版フラグ
値 publisher
URI
識別子 http://ci.nii.ac.jp/naid/110008800863/
識別子タイプ URI
URI
識別子 http://hdl.handle.net/2237/23571
識別子タイプ HDL
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