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Micromachined Sealed Cavities by Silicon Wafer Bonding for the Formation of Microstructures of Desired Thickness Using TMAH Etching
http://hdl.handle.net/2237/12096
http://hdl.handle.net/2237/120960fc4bce8-fc19-4676-86c0-7a20c5914314
名前 / ファイル | ライセンス | アクション |
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08_MHS_Prem.pdf (1.2 MB)
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Item type | 学術雑誌論文 / Journal Article(1) | |||||
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公開日 | 2009-08-26 | |||||
タイトル | ||||||
タイトル | Micromachined Sealed Cavities by Silicon Wafer Bonding for the Formation of Microstructures of Desired Thickness Using TMAH Etching | |||||
言語 | en | |||||
著者 |
Pal, Prem
× Pal, Prem× Sato, Kazuo |
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アクセス権 | ||||||
アクセス権 | open access | |||||
アクセス権URI | http://purl.org/coar/access_right/c_abf2 | |||||
権利 | ||||||
言語 | en | |||||
権利情報 | Copyright © 2008 IEEE. Reprinted from International Symposium on Micro-NanoMechatronics and Human Science, 2008. MHS 2008. p.12-16.<br/>This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Nagoya University’s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. | |||||
抄録 | ||||||
内容記述 | The present research report a fabrication process of suspended silicon microstructures of desired thickness over controlled depth micromachined cavities. The process is developed using direct wafer bonding to seal the micromachined cavities and wet anisotropic etching in pure and surfactant added tetramethyl ammonium hydroxide (TMAH) solutions. Wet anisotropic etching is used for the formation of cavities, thinning down the wafer for structural layer and releasing the structures. Non-ionic surfactant Triton-X-100 [C_14H_22O(C_2H_4O)_n] added TMAH is used to realize the microstructures with rounded concave and sharp convex corners. | |||||
言語 | en | |||||
内容記述タイプ | Abstract | |||||
出版者 | ||||||
言語 | en | |||||
出版者 | IEEE | |||||
言語 | ||||||
言語 | eng | |||||
資源タイプ | ||||||
資源タイプresource | http://purl.org/coar/resource_type/c_6501 | |||||
タイプ | journal article | |||||
出版タイプ | ||||||
出版タイプ | VoR | |||||
出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
DOI | ||||||
関連タイプ | isVersionOf | |||||
識別子タイプ | DOI | |||||
関連識別子 | https://doi.org/10.1109/MHS.2008.4752414 | |||||
書誌情報 |
en : International Symposium on Micro-NanoMechatronics and Human Science (MHS 2008) p. 12-16, 発行日 2008-11 |
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フォーマット | ||||||
application/pdf | ||||||
著者版フラグ | ||||||
値 | publisher | |||||
URI | ||||||
識別子 | http://dx.doi.org/10.1109/MHS.2008.4752414 | |||||
識別子タイプ | DOI | |||||
URI | ||||||
識別子 | http://hdl.handle.net/2237/12096 | |||||
識別子タイプ | HDL |