{"_buckets": {"deposit": "faa4543d-47f4-4c52-9d73-13b47e023071"}, "_deposit": {"id": "10276", "owners": [], "pid": {"revision_id": 0, "type": "depid", "value": "10276"}, "status": "published"}, "_oai": {"id": "oai:nagoya.repo.nii.ac.jp:00010276"}, "item_10_biblio_info_6": {"attribute_name": "\u66f8\u8a8c\u60c5\u5831", "attribute_value_mlt": [{"bibliographicIssueDates": {"bibliographicIssueDate": "2008-11", "bibliographicIssueDateType": "Issued"}, "bibliographicPageEnd": "16", "bibliographicPageStart": "12", "bibliographic_titles": [{"bibliographic_title": "International Symposium on Micro-NanoMechatronics and Human Science (MHS 2008)"}]}]}, "item_10_description_4": {"attribute_name": "\u6284\u9332", "attribute_value_mlt": [{"subitem_description": "The present research report a fabrication process of suspended silicon microstructures of desired thickness over controlled depth micromachined cavities. The process is developed using \ndirect wafer bonding to seal the micromachined cavities and wet anisotropic etching in pure and \nsurfactant added tetramethyl ammonium hydroxide (TMAH) solutions. Wet anisotropic etching is \nused for the formation of cavities, thinning down the wafer for structural layer and releasing \nthe structures. Non-ionic surfactant Triton-X-100 [C_14H_22O(C_2H_4O)_n] added TMAH is used to\n realize the microstructures with rounded concave and sharp convex corners.", "subitem_description_type": "Abstract"}]}, "item_10_identifier_60": {"attribute_name": "URI", "attribute_value_mlt": [{"subitem_identifier_type": "DOI", "subitem_identifier_uri": "http://dx.doi.org/10.1109/MHS.2008.4752414"}, {"subitem_identifier_type": "HDL", "subitem_identifier_uri": "http://hdl.handle.net/2237/12096"}]}, "item_10_publisher_32": {"attribute_name": "\u51fa\u7248\u8005", "attribute_value_mlt": [{"subitem_publisher": "IEEE"}]}, "item_10_rights_12": {"attribute_name": "\u6a29\u5229", "attribute_value_mlt": [{"subitem_rights": "Copyright \u00a9 2008 IEEE. Reprinted from International Symposium on Micro-NanoMechatronics and Human Science, 2008. MHS 2008. p.12-16.\nThis material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of Nagoya University\u2019s products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org."}]}, "item_10_select_15": {"attribute_name": "\u8457\u8005\u7248\u30d5\u30e9\u30b0", "attribute_value_mlt": [{"subitem_select_item": "publisher"}]}, "item_10_text_14": {"attribute_name": "\u30d5\u30a9\u30fc\u30de\u30c3\u30c8", "attribute_value_mlt": [{"subitem_text_value": "application/pdf"}]}, "item_creator": {"attribute_name": "\u8457\u8005", "attribute_type": "creator", "attribute_value_mlt": [{"creatorNames": [{"creatorName": "Pal, Prem"}], "nameIdentifiers": [{"nameIdentifier": "31153", "nameIdentifierScheme": "WEKO"}]}, {"creatorNames": [{"creatorName": "Sato, Kazuo"}], "nameIdentifiers": [{"nameIdentifier": "31154", "nameIdentifierScheme": "WEKO"}]}]}, "item_files": {"attribute_name": "\u30d5\u30a1\u30a4\u30eb\u60c5\u5831", "attribute_type": "file", "attribute_value_mlt": [{"accessrole": "open_date", "date": [{"dateType": "Available", "dateValue": "2018-02-20"}], "displaytype": "detail", "download_preview_message": "", "file_order": 0, "filename": "08_MHS_Prem.pdf", "filesize": [{"value": "1.2 MB"}], "format": "application/pdf", "future_date_message": "", "is_thumbnail": false, "licensetype": "license_free", "mimetype": "application/pdf", "size": 1200000.0, "url": {"label": "08_MHS_Prem.pdf", "url": "https://nagoya.repo.nii.ac.jp/record/10276/files/08_MHS_Prem.pdf"}, "version_id": "cce7413e-1f61-4e26-a66d-00d1cfb22071"}]}, "item_language": {"attribute_name": "\u8a00\u8a9e", "attribute_value_mlt": [{"subitem_language": "eng"}]}, "item_resource_type": {"attribute_name": "\u8cc7\u6e90\u30bf\u30a4\u30d7", "attribute_value_mlt": [{"resourcetype": "journal article", "resourceuri": "http://purl.org/coar/resource_type/c_6501"}]}, "item_title": "Micromachined Sealed Cavities by Silicon Wafer Bonding for the Formation of Microstructures of Desired Thickness Using TMAH Etching", "item_titles": {"attribute_name": "\u30bf\u30a4\u30c8\u30eb", "attribute_value_mlt": [{"subitem_title": "Micromachined Sealed Cavities by Silicon Wafer Bonding for the Formation of Microstructures of Desired Thickness Using TMAH Etching"}]}, "item_type_id": "10", "owner": "1", "path": ["320/502/503"], "permalink_uri": "http://hdl.handle.net/2237/12096", "pubdate": {"attribute_name": "\u516c\u958b\u65e5", "attribute_name_i18n": "\u516c\u958b\u65e5", "attribute_value": "2009-08-26"}, "publish_date": "2009-08-26", "publish_status": "0", "recid": "10276", "relation": {}, "relation_version_is_last": true, "title": ["Micromachined Sealed Cavities by Silicon Wafer Bonding for the Formation of Microstructures of Desired Thickness Using TMAH Etching"], "weko_shared_id": null}